多层印制电路板网印内埋电阻技术研究
金轶;何为;苏新虹;黄云钟;朱兴华
【期刊名称】《电子元件与材料》 【年(卷),期】2011(030)012
【摘要】Resistors were produced by screen printing conductive carbon paste, and embedded in multilayer PCB by lamination technique. The relations between curing temperature and curing time of conductive carbon paste and resistance were studied. Effects of conductive carbon paste curing degree and roasting after brown oxide on the reliability of lamination process were analyzed. The stability of embedded resistor was tested by the humidity test and the thermal shock test. The results show that conductive carbon paste curing at 170 ℃ for 4 h and baking at 105 ℃ for 1 h after brown oxide process is necessary condition to avoid delamination between the embedded resistor and the bond ply. The embedded resistors exhibit nice humidity resistance and thermal-shock resistance.%利用网印导电碳浆的方法制作电阻,通过层压工艺实现电阻在多层印制电路板中的内埋.研究了导电碳浆的固化温度及固化时间与电阻值的关系,分析了导电碳浆固化程度及棕化后烘板对层压工艺可靠性的影响,测试了高温高湿与冷热冲击对内埋电阻阻值稳定性的影响.结果表明:导电碳浆固化条件选择固化温度170℃,固化时间4h,以及棕化后105℃烘板1h,是避免层压后内埋电阻与粘结片分层的必要条件；层压后的内埋电阻具有良好的耐湿热性能与耐冷热冲击性能.
多层印制电路板网印内埋电阻技术研究
