缺陷尺寸对红外热波技术缺陷深度测量的影响研究
曾智;陶宁;冯立春;张存林
【期刊名称】《红外与激光工程》 【年(卷),期】2012(041)007
【摘要】Defect depth measurement is one of the major quantitative applications of thermal wave imaging and the current methods are based on ID heat conduction model. However, since the practical depth measurement is to retrieve defect depth which is of limited size. 3D heat diffusion influences the precision of defect depth measurement. One aluminum sample whose surface was treated with anode oxidation and one fiber reinforced plastics (FRP) sample were used, and thermal wave imaging was used as experimental scheme to obtain the temperature decay data series. The temperature-time curves of different positions in each wedge were extracted to approximately simulate that different depth defects with the same defect size were affected with different levels of 3D heat diffusion. The theoretical procedures of three different thickness measurement methods were analyzed based on ID heat conduction model, and the linear relationship between the characteristic time of each method and the square of defect depth was constructed. The results indicate that defect size influences the slope and intercept of eachrnlinearity, and the slope is affected more seriously when the thermal diffusivity is smaller.%缺陷深度测量是脉冲红外热波技术
缺陷尺寸对红外热波技术缺陷深度测量的影响研究
