TAPE CARRIER TYPE SEMICONDUCTOR DEVICE
申请(专利)号： JP19890056638
专利号： JPH02235353A 主分类号： H01L21/60 申请权利人： MITSUBISHI
ELECTRIC CORP
公开国代码： JP 优先权国家： JP
摘 要：
PURPOSE:To prevent the position
deviation and deformation of a lead at the time of cutting, and realize the sure soldering of a lead by respectively connecting the cutting part side tip of
each lead by using an insulating member. CONSTITUTION:A bridge part 12 which is the insulating member of a tape
member 1 is formed by boring a bridge part hole 11, and uses the residual part of the tape member 1 between the bridge part hole 11 and an outer lead hole 3. An inner lead part 5a is inserted into a center device hole 2, and lead terminal 5 is formed by bridging an outer lead part 5c on the outer lead hole 3 and the bridge part hole 11. Each protruding electrode 8 of a semiconductor element 7 and the inner lead part 5a are connected and sealed by using sealing material 9. An acceptable semiconductor element 7 tested by a test pad 5d is punched in a
申请日： 1989-03-08 公开公告日： 1990-09-18
分类号： H01L21/60
发明设计人： UEDA TETSUYA;
TERAOKA YASUHIRO; SHIMAMOTO HARUO;
YAGOURA HIDEYA; TACHIKAWA TORU 申请国代码： JP
优先权： 19890308 JP
5663889
摘 要 附 图：
body unified with the outer lead 5c, in the state where the bridge part 12 is attached to a soldering part 5b of the lead terminal 5. Thereby the position displacement and deformation of a lead can be prevented. 主权项：
权 利 要 求 说 明 书
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TAPE CARRIER TYPE SEMICONDUCTOR DEVICE
