Semiconductor wafer - polishing machine
申请(专利)号： DE1997128428
专利号： DE19728428B4 主分类号： H01L21/302 申请权利人： TOKYO SEIMITSU
CO. LTD., MITAKA, TOKIO/TOKYO, JP
公开国代码： DE 优先权国家： JP
摘 要：
Semiconductor wafer - polishing machine, in which a semiconductor wafer and a polishing wheel to be moved relative to one another and are pressed against one another, in order to obtain a
semiconductor wafer polishing, wherein the semiconductor wafer - polishing machine comprising:a rotate (52) with a disk-shaped portion (56), comprising the semiconductor wafer (12) facing the polishing disk (16), and with a columnar portion (54) which is derived from said disk-shaped portion (56) in a direction away from the polishing disk (16)
extends;a housing (46) comprising a disk-shaped base plate (50) and a guide ring (48) for holding the rotate (52), wherein said housing (46) has an opening (22), in which the columnar portion (54) of the
申请日： 1997-07-03 公开公告日： 2005-10-13
分类号： H01L21/302;
B24B37/04 发明设计人： OGURI, MASAAKI,
MITAKA,
TOKIO/TOKYO, JP; INABA, TAKAO, MITAKA,
TOKIO/TOKYO, JP; SAKAI, KENJI, MITAKA,
TOKIO/TOKYO, JP 申请国代码： DE
优先权： 19960712 JP 8-183324
摘 要 附 图：
rotate (52) with play (58, 60) is received, the both between the inner circumferential surface of the guide ring (48) and the columnar portion (54) as well as between the lower side of the guide ring (48) and the upper side of the disk-shaped portion (56) exists;an elastic film (64) with a cut-out shape, wherein a.. 主权项：
Halbleiterwafer-Poliermaschine, in welcher ein Halbleiterwafer und eine Polierscheibe relativ zuein
权 利 要 求 说 明 书
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Semiconductor wafer - polishing machine
