局部镀金与选择性沉金工艺研究
师博;董浩彬;曾志军
【期刊名称】《印制电路信息》 【年(卷),期】2013(000)0z1
【摘要】随着电子产品的不断发展，越来越多的客户倾向于采用局部镀金与选择性沉金的工艺设计，满足PCB产品即可耐插拔性能又能满足良好可焊性的双向需求。本文主要针对此类PCB产品的制作工艺进行研究，阐述此类产品在制作过程中的工程设计、工艺流程优化、异常处理及品质提升方案，为业界同仁提供参考。%As the electrical products developed, more and more customers like to use this technology design about a local gold plating and selective immersion Au, because it can meet customer’s satisfaction such as good pressing-ift resistance and solder resistance. In this paper, the technology of this method was studied, and it includes some schemes such as engineering design, technology improved, abnormity disposed, quality upgraded when these products were manufactured, and also this can give some suggestions to our craft brother in PCB industry. 【总页数】7页(196-202)
【关键词】局部镀金;选择性沉金;工程设计;工艺流程优化 【作者】师博;董浩彬;曾志军
【作者单位】广州兴森快捷电路科技有限公司，广东 广州 510063;广州兴森快捷电路科技有限公司，广东 广州 510063;广州兴森快捷电路科技有限公司，广
局部镀金与选择性沉金工艺研究
