集成电路各种封装大全
TO78 TO8 TO92 TO93 TO99 TSSOP or TSOP II Thin Shrink Outline Package TSOP Thin Small Outline Package uBGA Micro Ball Grid Array uBGA Micro Ball Grid Array ZIP Zig-Zag Inline Package BQFP132 CERQUAD Ceramic Quad Flat Pack LAMINATE CSP 112L Chip Scale Package C-Bend Lead Ceramic Case Gull Wing Leads 6
集成电路各种封装大全
PDIP PLCC SNAPTK SNAPTK
7
1集成电路各种封装大全_有图解
集成电路各种封装大全TO78TO8TO92TO93TO99TSSOPorTSOPIIThinShrinkOutlinePackageTSOPThinSmallOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArrayZIPZig-ZagIn
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