CPU封装与测试
摘要:封装对于芯片来说是必须的，也是至关重要的。因为芯片必须与外界隔离，
以防止空气中的杂质对芯片电路的腐蚀而造成电气性能下降。另一方面，封装后
的芯片也更便于安装和运输。由于封装技术的好坏还直接影响到芯片自身性能的
发挥和与之连接的PCB(印制电路板)的设计和制造，因此它是至关重要的。封 装的目的在与保护芯片不受或少受外界环境的影响，并为之提供一个良好的工作条件，
以使集成电路具有稳定，正常的功能。
OLF(离线锁频)是属于CPU的测试部分，是一个低成本高产量的技术工艺。机 器通过特定的程序控制不同的产品从而把CPU的频率锁在不同的范围。本文简单介绍
了OLF4000机器的工作原理，锁频工艺流程，以及平时常常遇到的一些问题和解决方
法。
关键词:封装 工艺流程 工作原理 离线锁频 问题解决方法
Summary: Sealing to pack for chip come say is have to of, BE also go to a pass important. Because the chip has to insulate with the external world, in order to prevent the miscellaneous quality in the air decay chip electric circuit but result in the electricity function descend. On the other hand, the chip which seals to pack behind is also easier to
install and transport. In order to seal, the quality of pack the technique still directly influences chip oneself function of exertive with it PCB(print to make circuit board) design and manufacturing of conjunction, therefore it is go to pass important. The purposes sealed to pack at with protection the chip is free from or be subjected to the influence of the external world environment less, and for it provide a good work condition to make integrated circuit to have stability, normal of function.
OLF(Off-Line-fuse)are the test part that belongs to CPU , is a low cost high yield the technical technology of quantity. Machines pass through the specific program product of not same control so the scope of frequency locks in difference of CPU. This paper is simple to have introduced the working principle of OLF4000 machine, lock frequency processing, as well as some problems that met normality often and solution method.
Keywords: Seal to pack Craft process Work principle Off-line-fuse Problem solution method
目 录 前
言 ......................................................................................................................... 4 第一章 微电子芯片封装工艺流程简
介 ..................................................................... 5
1.1封装的概
念 ..................................................................................................... 5
1.2芯片封装的分
类 ............................................................................................. 5
1.3芯片生产工艺流
程.......................................................................................... 7
1.4封装的可靠
性 ................................................................................................. 9
1.5先进的封装技
术 ............................................................................................10
第二章 CPU的发
展 .................................................................................................12
2.1国内外CPU的发展现
状 ...............................................................................12
2.2国内外CPU发展趋
势 ..................................................................................15 第三章 CPU封装测试工
CPU封装与测试
