界面改性对SiCp/Cu复合材料热物理性能的影响
刘猛;白书欣;李顺;赵恂;熊德赣
【期刊名称】《材料工程》 【年(卷),期】2016(044)008
【摘要】SiCp/Cu composites were successfully fabricated by vacuum hot‐pressing method .Molybde‐num coating w as deposited on the surface of silicon carbide by sol‐gel method .T he effects of the inter‐facial design on thermo‐physical properties of SiCp/Cu composites were studied .The results indicate that :continuous and uniform MoO3 coating can be deposited on the surface of silicon carbide by per‐oxomolybdic acid sol‐gel system ,and the best processing parameters are as follows :SiC∶ MoO3 =5∶1(mass ratio) ,H2 O2 ∶C2 H5 OH=1∶1(volume ratio) ,and surface pretreatment with acetone and hydrofluoric acid is good to the deposition and growth of MoO3 coating .After hydrogen reduction at 540℃ for 90min the MoO3 is changed into MoO2 ,and then hydrogen reduction at 940℃ for 90min the MoO2 is changed into Mo absolutely ,and the Mo coating is continuous and uniform .SiCp/Cu compos‐ites prepared by vacuum hot‐pressing method show a compact and uniform microstructure ,and the thermal conductivity of the composites is increased obviously after the Mo coating interfacial modifica‐tion ,w hich can reach 214 .16W · m -1 · K -1 w hen the volume of silicon carbide is about 50% .%采用热压烧
界面改性对SiCp/Cu复合材料热物理性能的影响
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