实用标准文案
DKBA
华为技术有限公司企业技术标准
DKBA3178.1-2006.07
代替Q/DKBA3178.1-2004
刚性PCB检验标准
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2006年06月29日发布 2006年07月01日实施
华为技术有限公司
Huawei Technologies Co., Ltd.
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版权所有 侵权必究 All rights reserved
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目 次
前 言 ......................................................................................................................................... 13 1 范围 ............................................................................................................................................. 16
1.1 范围 ................................................................................................................................ 16 1.2 简介 ................................................................................................................................ 16 1.3 关键词 ............................................................................................................................ 16 2 规范性引用文件 ........................................................................................................................ 16 3 术语和定义 ................................................................................................................................ 17 4 文件优先顺序 ............................................................................................................................ 18 5 材料品质 .................................................................................................................................... 18
5.1 板材 .................................................................................................................................. 18 5.2 介质厚度公差 .................................................................................................................. 19 5.3 金属箔 .............................................................................................................................. 19 5.4 镀层 .................................................................................................................................. 20 5.5 阻焊膜（Solder Mask） ............................................................................................. 20 5.6 标记油墨 .......................................................................................................................... 20 5.7 最终表面处理 .................................................................................................................. 20 6 外观特性 .................................................................................................................................... 20
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6.1 板边 .................................................................................................................................. 21
6.1.1 6.1.2 6.1.3
毛刺/毛头（burrs) ........................................................................................ 21 缺口/晕圈（nicks/haloing） ..................................................................... 21 板角/板边损伤 ................................................................................................ 22
6.2 板面 .................................................................................................................................. 22
6.2.1 6.2.2 6.2.3 6.2.4 6.2.5 6.2.6 6.2.7 6.2.8 6.2.9
板面污渍 .......................................................................................................... 22 水渍 .................................................................................................................. 22 异物（非导体） ............................................................................................. 22 锡渣残留 .......................................................................................................... 22 板面余铜 .......................................................................................................... 22 划伤/擦花（Scratch） ................................................................................. 23 压痕 .................................................................................................................. 23 凹坑(Pits and Voids) ................................................................................... 23 露织物/显布纹(Weave Exposure/Weave Texture） .......................... 24
6.3 次板面 .............................................................................................................................. 24
6.3.1 6.3.2 6.3.3
白斑/微裂纹(Measling/Crazing) .............................................................. 24 分层/起泡(Delamination/Blister) ............................................................ 25 外来夹杂物(Foreign Inclusions) ............................................................... 26
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6.3.4 内层棕化或黑化层擦伤 ................................................................................. 26
6.4 导线 .................................................................................................................................. 26
6.4.1 6.4.2 6.4.3 6.4.4 6.4.5 6.4.6 6.4.7 6.4.8 6.4.9
缺口/空洞/针孔 .............................................................................................. 26 镀层缺损 .......................................................................................................... 27 开路/短路 ........................................................................................................ 27 导线压痕 .......................................................................................................... 27 导线露铜 .......................................................................................................... 27 铜箔浮离 .......................................................................................................... 27 补线 .................................................................................................................. 27 导线粗糙 .......................................................................................................... 28 导线宽度 .......................................................................................................... 29
6.4.10 阻抗 .................................................................................................................. 29 6.5 金手指 .............................................................................................................................. 29
6.5.1 6.5.2 6.5.3 6.5.4 6.5.5
金手指光泽...................................................................................................... 29 阻焊膜上金手指 ............................................................................................. 29 金手指铜箔浮离 ............................................................................................. 29 金手指表面...................................................................................................... 30 金手指接壤处露铜 ......................................................................................... 30
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华为的刚性PCB检验实用实用实用标准
