IL2576HV/LM2576HV系列稳压器是单片集成电路，为降压型开关稳压器提供所有有源功能，能够以出色的线路和负载调节来驱动3A负载。这些设备提供3.3 V，5 V，12 V，15 V的固定输出电压，以及可调输出版本。 这些稳压器需要最少的外部组件，易于使用，并包括故障保护和固定频率振荡器。
IL2576HV/LM2576HV系列可为流行的三端线性稳压器提供高效替代。它大大减小了散热器的尺寸，并且在某些情况下不需要散热器。几个不同的制造商都提供了针对IL2576HV/LM2576HV系列使用而优化的标准系列电感器。此功能极大地简化了开关电源的设计。其他功能包括在规定的输入电压和输出负载条件下，输出电压的容差为±4％，在振荡器频率上的容差为±10％。包括外部关机功能，待机电流典型值为50 μA。输出开关包括逐周期限流以及热关断功能，可在故障情况下提供全面保护。
IL2576HV LM2576HVR-12 LM2576HVSX-12 LM2576HVS-ADJ LM2576HVR-12 LM2576HVT
这些稳压器需要最少的外部组件，易于使用，并具有故1 Features
障保护和固定频率振荡器。 ? LMR33630 36V，3A，400kHz同步转换器
? 3.3V，5V，12V，15V和可调输出版本
LM2576系列可为流行的三端线性稳压器提供高效替? 可调版本输出电压范围：1.23 V至37 V（对于HV
代。 它大大减小了散热器的尺寸，在某些情况下不需版本为57 V）在整个线路和负载条件下最大±4％
要散热器。 ? 指定的3A输出电流
? 宽输入电压范围：40 V，最高为HV 60 V
几个不同的制造商可提供针对LM2576使用而优化的? 仅需四个外部组件
标准系列电感器。 此功能极大地简化了开关电源的设? 52kHz固定频率内部振荡器
计。. ? TTL关机功能，低功耗待机模式
? 高效率 其他功能包括在规定的输入电压和输出负载条件下，输? 使用现成的标准电感器 出电压的容差为±4％，振荡器频率的容差为±10％。 ? 热关断和限流保护 包括外部关机功能，具有50μA（典型值）的待机电? 使用WEBENCH工具创建自定义设计 流。 输出开关包括逐周期电流限制，以及热关断功 能，可在故障情况下提供全面保护。 2 Applications
LMR33630具有许多其他功能，可降低BOM成本，提? 马达驱动
高效率并将解决方案尺寸减小85％。 请参阅设备比较? 商家网络和服务器PSU
表以比较规格。 使用LMR33630开始WEBENCH设
? 家电类
计。
? 测试测量设备
(1) Device Information 3 Description PART NUMBER PACKAGE BODY SIZE (NOM) LM2576HVR-12 LM2576HVSX-12 LM2576HVS-ADJ LM2576 TO-220 (5) 10.16 mm × 8.51 mm LM2576HVR-12 LM2576HVT稳压器是单片集成电LM2576HV DDPAK/TO-263 (5) 10.16 mm × 8.42 mm 路，为降压型开关稳压器提供所有有源功能，能够以出
(1) For all available packages, see the orderable addendum at the
色的线路和负载调节来驱动3A负载。 这些设备提供end of the data sheet. 3.3 V，5 V，12 V，15 V的固定输出电压，以及可调输出版本。
Fixed Output Voltage Version Typical Application Diagram
Table of Contents
1 Features .................................................................. 2 Applications ........................................................... 3 Description ............................................................. 4 Revision History.....................................................
1 1 1 2
8
7.3 Feature Description................................................. 12 7.4 Device Functional Modes........................................ 14
Application and Implementation ........................ 16
5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4
8.1 Application Information............................................ 16 8.2 Typical Applications ................................................ 20
6.1 Absolute Maximum Ratings ..................................... 4 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9
4 4 4 5 5 5 6 6 6 8
9 Power Supply Recommendations 10 Layout
25 26
ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: 3.3 V ................................ Electrical Characteristics: 5 V ................................... Electrical Characteristics: 12 V ................................. Electrical Characteristics: 15 V .................................
Electrical Characteristics: Adjustable Output
Voltage .......................................................................
6.10 Electrical Characteristics: All Output Voltage Versions ..................................................................... 6.11 Typical Characteristics ............................................
10.1 10.2 10.3 10.4 11.1 11.2 11.3 11.4 11.5 11.6 11.7
Layout Guidelines ................................................. 26 Layout Example .................................................... 27 Grounding ............................................................. 27 Heat Sink and Thermal Considerations ................ 27
11 Device and Documentation Support 29
Device Support .................................................... 29 Documentation Support ........................................ 30 Related Links ........................................................ 30 Support Resources ............................................... 30 Receiving Notification of Documentation Updates 30 Trademarks ........................................................... 30 Electrostatic Discharge Caution............................ 30
7 Detailed Description ............................................ 12 7.1 Overview ................................................................. 12 7.2 Functional Block Diagram ....................................... 12
11.8 Glossary ................................................................ 31
12 Mechanical, Packaging, and Orderable
Information ........................................................... 31
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (May 2016) to Revision E
Page
1 Page
? Added information about the LMR33630 ...............................................................................................................................
Changes from Revision C (April 2013) to Revision D
?
?
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1 Moved the thermal resistance data from the Electrical Characteristics: All Output Voltage Versions table to the
Thermal Information table ...................................................................................................................................................... 4
Page
Changes from Revision B (April 2013) to Revision C
?3 Changed layout of National Data Sheet to TI format ..............................................................................................................
5 Pin Configuration and Functions
KC Package 5-Pin TO-220 Top View
KTT Package 5-PIN DDPAK/TO-263
Top View
DDPAK/TO-263 (S) Package 5-Lead Surface-Mount Package
Top View
NO. PIN I/O(1) Pin Functions DESCRIPTION Supply input pin to collector pin of high-side transistor. Connect to power supply and input bypass capacitors CIN. Path from VIN pin to high-frequency bypass CIN and GND must be as NAME 1 2 V IN I O OUTPUT GROUND FEEDBACK short as possible. Emitter pin of the power transistor. This is a switching node. Attach this pin to an inductor and the cathode of the external diode. Ground pin. Path to CIN must be as short as possible. Feedback sense input pin. Connect to the midpoint of feedback divider to set VOUT for ADJ version or connect this pin directly to the output capacitor for a fixed output version. Enable input to the voltage regulator. High = OFF and low = ON. Connect to GND to enable the voltage regulator. Do not leave this pin float. Connected to GND. Attached to heatsink for thermal relief for TO-220 package or put a copper plane connected to this pin as a thermal relief for DDPAK package. 3 4 — I 5 ON/OFF I — (1) I = INPUT, O = OUTPUT — TAB
6 Specifications
6.1 Absolute Maximum Ratings
over the recommended operating junction temperature range of -40°C to 125°C (unless otherwise noted)(1)(2) LM2576 LM2576HV MIN MAX 45 63 UNIT V V V Maximum supply voltage ON /OFF pin input voltage (Steady-state) ?0.3V ≤ V ≤ +VIN ?1 Output voltage to ground Power dissipation Maximum junction temperature, TJ Storage temperature, Tstg Internally Limited °C °C ?65 150 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
6.2 ESD Ratings
V Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) VALUE ±2000 (ESD) Electrostatic discharge UNIT V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Temperature LM2576, LM2576HV LM2576 LM2576HV over the recommended operating junction temperature range of -40°C to 125°C (unless otherwise noted) MIN ?40 Supply voltage MAX 125 40 60 UNIT °C V
6.4 Thermal Information RθJA RθJC(top) RθJB ψJT ψJB RθJC(bot)THERMAL METRIC(1)(2)(3) LM2576, LM2576HV KTT (TO-263) 5 PINS 42.6 43.3 22.4 10.7 21.3 0.4 KC (TO-220) 5 PINS 32.4 41.2 17.6 7.8 17 0.4 UNIT Junction-to-ambient thermal resistance Junction-to-case (top) thermal resistance Junction-to-board thermal resistance Junction-to-top characterization parameter Junction-to-board characterization parameter Junction-to-case (bottom) thermal resistance °C/W °C/W °C/W °C/W °C/W °C/W (1)
(2) (3)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953 and the Using New Thermal Metrics applications report, SBVA025. The package thermal impedance is calculated in accordance with JESD 51-7 Thermal Resistances were simulated on a 4-layer, JEDEC board.
LM2576HVSX-12 TI高压三端稳压器 - 图文
