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电子设计毕业设计-功放芯片-TDA7050T_CNV_2

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INTEGRATED CIRCUITSDATA SHEETTDA7050TLow voltage mono/stereo poweramplifierProduct speci?cation

File under Integrated Circuits, IC01

July1994

Philips SemiconductorsProduct speci?cation

Low voltage mono/stereo power ampli?er

GENERAL DESCRIPTION

TDA7050T

The TDA7050T is a low voltage audio amplifier for small radios with headphones (such as watch, pen and pocket radios)in mono (bridge-tied load) or stereo applications.Features

?Limited to battery supply application only (typ. 3 and 4 V)?Operates with supply voltage down to 1,6 V?No external components required?Very low quiescent current

?Fixed integrated gain of 26 dB, floating differential input?Flexibility in use?mono BTL as well as stereo

?Small dimension of encapsulation (see package design example).QUICK REFERENCE DATASupply voltage range

Total quiescent current (at VP= 3 V)Bridge tied load application (BTL)Output power at RL= 32? VP= 3 V; dtot= 10%

D.C. output offset voltage between the outputsNoise output voltage (r.m.s. value) at f = 1 kHz; RS= 5 k?Stereo applicationOutput power at RL= 32? dtot= 10%; VP= 3 V dtot= 10%; VP= 4,5 V

Channel separation at RS= 0?; f = 1 kHzNoise output voltage (r.m.s. value) at f = 1 kHz; RS= 5 k?PACKAGE OUTLINE

8-lead mini-pack; plastic (SO8; SOT96A); SOT96-1; 1996July24.

Vno(rms)

typ.

100μV

PoPoα

typ.typ.typ.

35mW75mW40dB

Vno(rms)

typ.

140μV

Po|?V|

typ.max.

140mW70mV

VPItot

typ.

1,6 to 6,0V

3,2mA

July19942

Philips SemiconductorsProduct speci?cation

Low voltage mono/stereo power ampli?er

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)Supply voltagePeak output currentTotal power dissipationStorage temperature rangeCrystal temperature

A.C. and d.c. short-circuit duration at VP= 3,0 V (during mishandling)

tscVPIOMTstgTc

TDA7050T

max.max.

6V150mA

see derating curve Fig.1

?55 to +150°Cmax.max.

100°C5s

handbook, halfpage600MLB950Ptot(mW)400200050050100150oT ( C)ambFig.1 Power derating curve.SO PACKAGE DESIGN EXAMPLE

To achieve the small dimension of the encapsulation the SO package is preferred with only 8 pins. Because a heatsink

is not applicable, the dissipation is limited by the thermal resistance of the 8-pin SO encapsulation until:Tjmax–Tamb100–60---------------------------------=----------------------=0.25W160Rthj-a

July19943

Philips SemiconductorsProduct speci?cation

Low voltage mono/stereo power ampli?er

CHARACTERISTICS

VP=3 V; f=1 kHz; RL=32?; Tamb=25°C; unless otherwise speci?ed

PARAMETERSupplySupply voltageTotal quiescent currentBridge-tied load application (BTL);see Fig.4Output power* VP= 3,0 V; dtot= 10% VP= 4,5 V; dtot= 10% (RL= 64?)Voltage gainNoise output voltage (r.m.s. value) RS= 5 k?; f = 1 kHz RS= 0?; f = 500 kHz; B = 5 kHzD.C. output offset voltage (at RS= 5 k?)Input impedance (at RS=∞)Input bias currentStereo application;see Fig.5Output power* VP= 3,0 V; dtot= 10% VP= 4,5 V; dtot= 10%Voltage gainNoise output voltage (r.m.s. value) RS= 5 k?; f = 1 kHz RS= 0?; f = 500 kHz; B = 5 kHzChannel separation RS = 0?; f = 1 kHzInput impedance (at RS=∞)Input bias currentα|Zi|Ii302?40?20???Vno(rms)Vno(rms)??100tbf??PoPoGv??24.5357526??Vno(rms)Vno(rms)|?V||Zi|Ii???1?140tbf??40??PoPoGv???14015032???VPItot1,6??3,2SYMBOLMIN.TYP.TDA7050T

MAX.UNIT6,04VmAmWmWdBμVμVmVM?nA70??mWmWdBμVμVdBM?nA27.5*Output power is measured directly at the output pins of the IC. It is shown as a function of the supply voltage in Fig.2

(BTL application) and Fig.3 (stereo application).

July19944

Philips SemiconductorsProduct speci?cation

Low voltage mono/stereo power ampli?erTDA7050T

Fig.2Output power across the load impedance (RL) as a function of supply voltage (VP) in BTL application.Measurements were made at f = 1 kHz; dtot = 10%; Tamb = 25°C.Fig.3Output power across the load impedance (RL) as a function of supply voltage (VP) in stereo application.Measurements were made at f = 1 kHz; dtot = 10%; Tamb = 25°C.5

July1994

电子设计毕业设计-功放芯片-TDA7050T_CNV_2

INTEGRATEDCIRCUITSDATASHEETTDA7050TLowvoltagemono/stereopoweramplifierProductspeci?cationFileunderIntegratedCircuits,IC01July1994PhilipsSemiconductorsProductspeci?c
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