化学微蚀工艺对铜面表观粗糙度的影响研究
叶非华;刘攀;常润川
【期刊名称】《印制电路信息》 【年(卷),期】2013(000)0z1
【摘要】As electronic products developed in the direction toward the light, small and thin, PCB wiring density products also increased, which also bring greater challenges to the circuitry making. Chemical micro-etching process as a key factor in the production of circuit to study its impact on the copper surface roughness became increasingly important. This paper comparative studied on impact of different chemical pretreatment microetch potion system on the copper surface roughness, including sulfuric acid-sodium persulfate, sulfuric acid-hydrogen peroxide and formic acid-cupric chloride. Used three-dimensional non-contact optical proifler measure the surface roughness, got the changing trends between microetch volume and roughness of each potion. The results showed that: if the composition of each potion is under certain conditions, the copper’s surface roughness and microetching amount had no obvious relationship when it was etched by sulfuric acid-sodium persulfate;showed the trend that ifrst increases, then decreases, then increases when it was etched by sulfuric acid-hydrogen peroxide;Showed the trend that ifrst increases ,then lfattens when it was etched by formic acid-cupric chloride.%随着电子产品朝轻小
化学微蚀工艺对铜面表观粗糙度的影响研究
