一. 锡膏规格如下/SPCIFICATION
测试项目/Item
外观/Physical state
焊剂成份/Flux content (wt%)
粘度/Viscosity（25℃，Malcon sensor, 10rpm Pa.s ） 粒径与形状/Grain size and shade(μm) 合金规格/Alloy type
铜镜测试/Copper mirror test
绝缘阻抗值/ Surface insulation resistance 铜板腐蚀/ Copper corrosion tests 坍塌试验/Slump test 贮存条件/Shelf condition 贮存寿命/Shelf life
规格值/Specification 平滑膏状/Smooth paste 9.0±0.5 180±30
25-45/球形/sphericitySn64 Bi35Ag1 PASS ≥1011Ω未腐蚀/No corrosion PASS
5°C-10°C 6个月/6 months
测试方法/Test method IPC-TM-650 JIS-Z-3197 IPC-TM-650
IPC-TM-650
JIS-Z-3197，IPC-TM-650IPC-TM-650 IPC-TM-650
二..锡膏使用温度曲线图（仅供参考）/TEMPERATURE CUREVED LINE
Peak Temp 210-225 C 1.3-1.6 c/sec .05-0.6c/sec Soaking Zone (2min max) 60-90 sec. typical<2.5c/sec Reflow Zone (30-90 sec.max) 30-60 sec.typicalPre-heating Zone (2.0-4.0 min. max.) 三.特性 / CHARACTERISTCS
特制焊剂确保高可靠性能及优良润湿性。
Specially developed flux ensure high reliability and excellent wet ability. 焊剂残渣是非腐蚀及能显示良好电气性能。
Flux residue is non-corrosive and exhibits superior electrical properties
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能准确控制焊粉，25-45μm特制焊剂确保良好的连续性印刷。
Precisely controlled solder powder , 25-45μm, and specially developed flux ensure good continual printability with fine pitch pattern. 持久粘性。
Time of tacky is very long 四 保存及处理预防措施/PRECAUTIONS AGAINST STORING AND HANDLING
尽量小心使用焊膏，避免接触皮肤。若附于衣服或身体时，应尽快用含有酒精的溶剂把焊膏抹掉。 Do not touch solder paste bare-handed. Remove with ethyl alcohol from body or clothes if contaminated by solder paste.
不要吸入回流时喷出的蒸汽。
Do not inhale the vapor during reflow. 焊接工作后要洗手
Wash hands and rinse mouth before meals and after soldering. 安装排气管于焊接区
Install exhaust pipe at soldering area. 保存焊膏于冰箱（5°C-10°C）
keep this product in refrigeration at（5°C-10°C）
焊膏从冰箱取出时，应放置4小时直至回复室温。解冻不开封在常温下可放置时间24小时。
Leave solder paste for 4 hours at room temperature before use.Unseal solder paste be stored 24 hours in room temperature .
从容器内取出所需份量的焊膏，一经使用后，不要放回原来之容器内,应抛弃，或应存于另外之容器放在冰箱内（5°C-10°C）至少24小时才能再次使用。
Once required quantity to be taken out from the container .it should not be returned to original container ，should abandon or stored in a new contained in refrigeration at （5°C-10°C）for at least24 hours for next usage.
使用时搅拌容器内的焊膏。锡膏钢网寿命为8小时 Stir solder paste in container before use. Solder paste stencil life 8 hours 印刷后要在2小时内回流焊膏。
Reflow solder paste in 2 hours as soon as possible after printing. 使用焊膏的适当室温大约23°C -25°C，湿度60%以下。
The proper room temperature for soldering is about 23°C -25°C, humidity is below 60%. 不要将焊膏放近于风口的位置，因为这样会令焊膏中的溶剂容易蒸发，降低其粘性。
Solvent may be easily vaporized when solder paste is contacted with air-conditioned current or wind and hence reducing its tackiness.
五.保质期限 /GUARANTEE PERIOD
产品保证期限由制造日起6个月未开启存放于冰箱内（5°C-10°C）
The guarantee period should be six months from the manufacturing date if kept sealed in refrigeration at （5°C-10°C）
六.包装 / PACKAGE
焊膏（净重500克）盛于塑料容器内。 Net 500g in one plastic container.。 （如有改动，以最新规格表资料为准）
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Sn64 Bi35Ag1锡膏技术规格书
