基于电路故障预测的高速老化感应器
王超;徐辉;黄正峰;易茂祥
【期刊名称】《合肥工业大学学报（自然科学版）》 【年(卷),期】2013(000)012
【摘要】CM OS集成电路中由负温度不稳定性效应引起的老化已经严重威胁电路的可靠性，在一些安全关键领域的数字电路系统中老化问题尤为突出，而片上在线老化感应器是有效解决方案。文章提出了一种适应高速芯片使用的新老化感应器，通过利用感应器中稳定检测器的空闲时序，使其具有较好性能和更小的面积开销。在45 nm工艺下仿真表明，新结构非常有效。%The aging in CMOS integrated circuit caused by negative bias temperature instability (NBTI) effect has been a serious threat to the reliability of the circuit .The aging of digital circuit system in the safety-critical fields is a particularly prominent problem .For safe operation ,on-line on-chip aging sensor is an effective solution .A new aging sensor adapted to the high-speed chip is proposed in this paper .By using the idle timing of stability checker in the sensor ,the new aging sensor achieves better performance and a smaller area overhead .The results of the simulation with a 45 nm sensor design verify the effectiveness of the proposed solution .
【总页数】4页(1447-1450)
【关键词】负偏置温度不稳定性;电路老化;老化感应器;故障预测;可靠性 【作者】王超;徐辉;黄正峰;易茂祥
基于电路故障预测的高速老化感应器
