PROGRAMMING REACTIVE COMPONENTS
申请(专利)号： US201816048821
专利号： US2020035550A1 主分类号： H01L21/768
申请日： 2018-07-30 公开公告日： 2020-01-30
分类号： H01L21/768;
H01L27/02; H01L21/66; H01L21/78; H01L23/522 发明设计人： PAUL MERLE
EMERSON; BENJAMIN
STASSEN COOK 申请国代码： US
优先权： 20180730 US
201816048821
摘 要 附 图：
申请权利人： TEXAS
INSTRUMENTS INCORPORATED 公开国代码： US 优先权国家： US
摘 要：
Electronic device manufacturing and
configuration methods include performing an additive deposition process that deposits a conductive, resistive,
magnetic, semiconductor and/or thermally conductive material over a surface of a processed wafer metallization structure to set or adjust a circuit of a capacitor, an inductor, a resistor, an antenna and/or a thermal component of the metallization structure. 主权项：
1. A method of manufacturing an integrated circuit, the method comprising: 权 利 要 求 说 明 书 【PROGRAMMING REACTIVE COMPONENTS】的权利说明书内容是......请下载后查看 说 明 书 【PROGRAMMING REACTIVE COMPONENTS】的说明书内容是......请下载后查看
PROGRAMMING REACTIVE COMPONENTS
