METHOD FOR SOLDERING ON PRINTED CIRCUIT
BOARD
申请(专利)号： JP19970010023
专利号： JPH10215057A 主分类号： H05K3/34 申请权利人： OTIS ELEVATOR
CO 公开国代码： JP 优先权国家： JP
申请日： 1997-01-23 公开公告日： 1998-08-11
分类号： H05K3/34;
H05K3/34 发明设计人： TSUKAMOTO
YOSHINOBU 申请国代码： JP
优先权： 19970123 JP
1002397
摘 要 附 图：
摘 要：
PROBLEM TO BE SOLVED: To provide a soldering method which does not permit the continuity between the leads of electronic parts mounted on a printed circuit board. ;SOLUTION: When
soldering a lead 13 of a pair of leads 13, 14a of an electronic part to a land 9 of a pair of lands 9, 10a provided adjacently on a printed circuit board 2, an adhesive 3 is coated to another land 10a, and an adhesive 3 is squeezed out between another land 10a and another lead 14a while adhering the lead 14a to the land 10a, then a pair of lands 9, 10 and a pair of leads 13, 14a are soldered, then the land 9 is soldered to the lead 13, and the land 10a and the lead 14a are not
soldered because of the squeezed-out adhesive 3.;COPYRIGHT: (C)1998,JPO 主权项：
【請求項1】 プリント基板に隣接して設けられた一対のランドの一方に、電子部品の一対のリードの一方を半田付けする場合において、他方のランドに接着剤を塗布し
てからこの他方のランドに他方のリードを接着させ
权 利 要 求 说 明 书
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METHOD FOR SOLDERING ON PRINTED CIRCUIT BOARD
