接触热阻的计算及ICEPAK环境下的数值模拟
吴圣陶;曾柯杰;刘恒
【期刊名称】《通信技术》 【年(卷),期】2013(000)001
【摘要】 为解决通信装备大功率芯片与散热器之间接触热阻的难以估算的现实问题，从粗糙表面的微观数学描述入手，采用截锥体的粗糙峰形状论述粗糙表面的数学模型，并结合接触分热阻理论建立了接触热阻的计算模型。为便于实际应用，对该计算模型进行了工程简化；应用ICEPAK软件结合粗糙表面的数学模型建立了热仿真模型，并对四个工况的接触热阻进行数值模拟，通过对比简化模型和数值模拟的计算结果表明：在通常情况下简化模型对于预测接触热阻具有一定的工程实用价值。%In order to find solution for complicated calculation of thermal contact resistance between chip and heat sink in communication equipment, with the microcosmic mathematics model and by using the frustum the surface roughness is discussed. Based on thermal resistance theory, a mathematic model for computing thermal contact resistance is established, and this model is also simplefied to improve its practicability. Based on the microcosmic mathematics model of rough surface, a thermal simulation model with ICEPAK is constructed, and the thermal contact resistances in four cases are simulated numerically under ICEPAK. The comparion of the results with simplified model and numerical simulation indicates that the simplified model is of certain practical value in estimating the thermal
接触热阻的计算及ICEPAK环境下的数值模拟
