SEMICONDUCTOR DEVICE PLACING SOCKET
申请(专利)号： JP19900074032
专利号： JPH03272584A 主分类号： H01R33/76 申请权利人： MITSUBISHI
ELECTRIC CORP
公开国代码： JP 优先权国家： JP
摘 要：
PURPOSE:To have easy connecting of a semiconductor device and accomplish connection with high reliability by making a conductor, which fixes a signaling pin of the semiconductor device, from the same material as the conductor of the lead. CONSTITUTION:Assembly of a
conductor 7 and an insulative member 8 is secured to a signaling pin 1b of a
semiconductor device concerned 1, which is fixed to a base board 9, whose recess 9a is filled with substance which solidifies so as to fix the conductor 7 and base board 9 together. The signaling pin 1b of the semiconductor device 1 is inserted in this conductor 7, and thereby the
signaling pin 1b and conductor 7 are put in connection electrically. Other electric appliances are connected with the conductor 7 in which several signaling pins 1b are inserted, and a specific voltage is impressed or specific current applied on/to a certain specific pin 1b of the semiconductor device 1, which is thus operated. This eliminates the work of
申请日： 1990-03-22 公开公告日： 1991-12-04
分类号： H01R33/76 发明设计人： KAWAGOE
TOMOYA; NISHIMURA YASUMASA 申请国代码： JP
优先权： 19900322 JP
7403290
摘 要 附 图：
connecting the signaling pin of
semiconductor device with the conductor, which facilitates works, and poor connection is not likely to occur. 主权项：
权 利 要 求 说 明 书
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SEMICONDUCTOR DEVICE PLACING SOCKET
