Integrated circuit packaging
申请(专利)号： GB19860008696
专利号： GB2189084A 主分类号： H05K1/18 申请权利人： * STC PLC
公开国代码： GB 优先权国家： GB
摘 要：
A package assembly for a plurality of integrated circuits, e.g. GaAs circuits, comprises a multilayer circuit board (11) having openings (17) for receiving the circuit chips (18). The circuits are
connected to an upper metallisation level (16a), interconnections being provided by one or more lower levels (16b).
Connections between levels are effected via plated through holes passing through openings in intervening ground planes (15). <IMAGE> 主权项： CLAIMS/n
申请日： 1986-04-10 公开公告日： 1987-10-14
分类号： H05K1/18;
H01L23/12
发明设计人： GRAEME KENNETH
* BARKER;
JOHN MICHAEL * YOUNG 申请国代码： GB
优先权： 19860410 GB
8608696
摘 要 附 图：
权 利 要 求 说 明 书
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说 明 书
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Integrated circuit packaging
