IPC-标准的中英文目录

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电子组装（Assembly）

IPC-T-50F IPC-S-100 IPC-E-500 IPC-TM-650 IPC-ESD-20-20 IPC/EIA J-STD-001C IPC-HDBK-001 IPC-A-610C IPC-HDBK-610 IPC-EA-100-K IPC/WHMA-A-620 IPC/EIA J-STD-012 IPC-SM-784 IPC/EIA J-STD-026 J-STD-027 IPC/EIA J-STD-028

Terms and Definition for Interconnecting and Packaging Electronic Circuits

电子电路互连与封装的定义和术语 Standards and Specifications Manual 标准和详细说明汇编手册

IPC Electronic Document Collection

已出版的IPC标准电子文档资料合订本 Test Methods Manual 试验方法手册

Association Standard for the Development of an ESD Control Program

静电释放控制过程(由静电释放协会制定)

Requirements for Soldered Electrical & Electronic Assemblies 电气与电子组装件锡焊要求

Handbook and Guide to Supplement J-STD-001—Includes Amendment 1

J-STD-001辅助手册及指南及修改说明1 Acceptability of Electronic Assemblies 印制板组装件验收条件

Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison

IPC-610手册和指南(包括IPC-A-610B和C的对比) Electronic Assembly Reference Set

电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。

Requirements and Acceptance for Cable and Wire Harness Assemblies

电缆和引线贴装的要求和验收

Implementation of Flip Chip and Chip Scale Technology 倒装芯片及芯片级封装技术的应用

Guidelines for Chip-on-Board Technology Implementation 芯片直装技术实施导则

Semiconductor Design Standard for Flip Chip Applications 倒装芯片用半导体设计标准

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

FC（倒装片）和CSP(芯片级封装)的外形轮廓标准

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

倒装芯片及芯片级凸块结构的性能标准

SMC-WP-003 J-STD-013 IPC-7095 IPC/EIA J-STD-032 IT-98000

IT-98080 IT-98093 IPC-MC-790 IPC-M-108 IPC-TP-1113 IPC-CH-65A IPC-SC-60A IPC-SA-61 IPC-AC-62A IPC-TR-476A

IPC-TR-580 IPC-TR-582

Chip Mounting Technology 芯片贴装技术

Implementation of Ball Grid Array and Other High Density Technology

球栅阵列 (BGA)及其它高密度封装技术的应用

Design and Assembly Process Implementation for BGAs 球栅阵列的设计与组装过程的实施 Performance Standard for Ball Grid Array Balls BGA球形凸点的标准规范

JPL Chip Scale Packaging Guidelines JPL 发布的CSP导则

注：IT (The California Institute of Technology) JPL (The Jet Propulsion Laboratory) JPL Ball Grid Array Packaging Guidelines JPL 发布的BGA封装导则

ITRI Chip Carrier, Phase 1 Report ITRI 关于芯片载体的报告

ITRI (The Interconnect Technology Research Institute) Guidelines for Multichip Module Technology Utilization 多芯片组件技术应用导则

Cleaning Guides and Handbook Manual 清洗导则和手册

Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?

电路板离子洁净度测量：它告诉我们什么？

Guidelines for Cleaning of Printed Boards & Assemblies 印制板及组装件清洗导则

Post Solder Solvent Cleaning Handbook 锡焊后溶剂清洗手册

Post Solder Semi-aqueous Cleaning Handbook 锡焊后半水溶剂清洗手册

Aqueous Post Solder Cleaning Handbook 锡焊后水溶液清洗手册

Electrochemical Migration: Electrically Induced Failures in Printed

Circuit Assemblies

电化学迁移：印制电路组件的电气诱发故障

Cleaning and Cleanliness Test Program Phase 1 Test Results 清洗及清洁度试验计划1阶段试验结果

Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air IPC第3阶段非清洗助焊剂研究

IPC-TR-583 IPC-9201 IPC-TP-104K

IPC-M-109

IPC/JEDEC J-STD-020B IPC/JEDEC J-STD-033AIPC/JEDEC J-STD-035 IPC-9500-K IPC-DRM-18F IPC-DRM-SMT-C IPC-DRM-40E IPC-DRM-56 IPC-DRM-53 IPC-M-103 IPC-M-104 IPC-TA-722 IPC-TA-723 IPC-TA-724

An In-Depth Look At Ionic Cleanliness Testing 深入离子洁净度测试

Surface Insulation Resistance Handbook 表面绝缘电阻手册

Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,

Part 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分

Component Handling Manual 元件处理手册

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

非密封固态表面贴装器件湿度／再流焊敏感度分类 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

非气密封装电子元件用声波显微镜 Set of four documents 9501-9504 9501至9504手册合订本

Component Identification Desk Reference Manual 零件分类标识手册

Surface Mount Solder Joint Evaluation Desk Reference Manual 接插件焊接点评价手册