GENERAL DESCRIPTION FEATURES
?低
SGM3005是一款双通道，低导通电阻，低V
压，双向，单刀双掷（SPDT）CMOS模拟开 ?低导通电阻：0。5Ω关，设计用于采用+ 1.8V至+ 5.5V单电（TYP） 源供电。 目标应用包括受益于低RON ?低导通电阻平坦度 （0.5Ω）和快速开关速度（tON = 16 ? –3 dB带宽：30 MHz ns，tOFF = 15 ns）的电池供电设备。 ?快速切换时间 在整个模拟信号范围内，导通电阻曲线非 tON 16 ns 常平坦。 这样可在切换音频信号时确保tOFF 15 ns 出色的线性度和低失真。 SGM3005是专用?轨到轨操作 的双单刀双掷（SPDT），包括两个常开
（NO）和两个常闭（NC）开关。 此配置?典型功耗（<0.01 μW） 可以用作双2对1多路复用器。 SGM3005 ?兼容TTL / CMOS
?超小型包装 提供MSOP-10和DFN-10封装。.
压操作：1。8 V至5. 5
PIN CONFIGURATIONS（TOP VIEW）
APPLICATIONS
?
? ? ? ? ? ? ? ?
电池供电的手持式和便携式设备 蜂窝电话/手机
笔记本电脑，笔记本电脑，掌上电脑 通讯系统 采样保持电路 音频信号路由 音视频切换
便携式测试与测量 医疗设备
ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS
V+ to GND....................................................................- 0.3V to +6V Analog, Digital voltage range(1)..................... - 0.3V to V+ + 0.3V
Continuous Current NO, NC, or COM..........................±300mA Peak Current NO, NC, or COM......................................±500mA Operating Temperature Range...........................- 40°C to +125°C Junction Temperature...........................................................+150°C
Storage Temperature.............................................- 65°C to +150°C
Package Thermal Resistance @ TA = 25℃
DFN-10, θJA........................................................................................33℃/W
MSOP-10, θJA...................................................................................205℃/W
ead Temperature (soldering, 10s).......................................260°C L
ESD Susceptibility
HBM..........................................................................................2000V
MM..............................................................................................400V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
(1) Signals on NC, NO, or COM or IN exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
PIN DESCRIPTION
NAME
V+ GND IN1, IN2 COM1, COM2 NO1, NO2 NC1, NC2
PIN
1 6 4,8 3,9 2,10 5,7
Power supply ground
FUNCTION
Digital control pin to connect the COM terminal to the NO or NC terminals Common terminal Normally-open terminal Normally-closed terminal
Note: NO, NC and COM terminal may be an input or output.
ELECTRICAL CHARACTERISTICS
(V+ = +3 V ± 10%, GND = 0 V, TA = - 40°C to +125°C, unless otherwise noted. Typical values are at TA = + 25°C.)
TYPICAL PERFORMANCE CHARACTERISTICS
On Response vs.Frequency 3
V+
= +5V TA = +25℃
0
-3
-6
-9
0.1 1 10 100
Frequency(MHz)
Off Isolation vs.Frequency
-20
-30
V+ = +5V TA = +25℃
-40 -50 -60 -70 -80 -90 -100
0.01 0.1 1 10
Frequency(MHz)
Crosstalk vs.Frequency
-50
V+ = +5V
TA = +25℃
-60
-70
-80 -90
-100
-110
0.01 0.1 1 10
Frequency(MHz)
5
TEST CIRCUITS
10mA V1
NO or NC
VNO or VNC
RON = V1/10mA
COM
Test Circuit 1. On Resistance
INC(OFF) or INO(OFF) NO or NC
COM
VNO or VNC
VCOM
NO or NC
COM
ICOM(ON)
A
VNO or VNC
A
VCOM
Test Circuit 2: Off Leakage Test Circuit 3: On Leakage
V+
0.1μF
V +
NO or NC
COM
R
IN
300Ω
CL
35pF
VOUT
VOUT
VIN 50%
50% 90%
V or V
90%
GND
tON
tOFF
Test Circuit 4: Switching Times
V+
0.1μF
V+
RG
NO or NC
COM
VOUT
IN
GND
CL 1nF
VOUT VIN
ON
ΔVOUT
V+
VG
ON
OFF
0V
VIN
Test Circuit 5: Charge Injection
6
TEST CIRCUITS(Cont.)
V+
0.1μF
V+
COM
RL 300Ω
GND
VNO or VNC
IN
NC NO
VOUT CL 35pF
VIN
0
50%
VNO or VNC
VOUT
tD
90%
Test Circuit 6. Break-Before-Make Time Delay, tD
V+
0.1μF
V+
NO or NC
Source Signal
IN
GND
COM
RL 50Ω
VOUT CL 5pF
Test Circuit 7. Off Isolation
V+
0.1μF
V+
NO or NC
Source Signal
IN1
COM
RL 50Ω
CL 5pF
IN2
N.C.
NO or NC
GND
COM
RL 50Ω
VOUT CL 5pF
Channel To Channel Crosstalk = -20×log V
NO
or VNC VOUT
Test Circuit 8. Channel-to-Channel Crosstalk
7
TEST CIRCUITS(Cont.)
V+
0.1μF
V+
NO or NC
COM
Source Signal
IN
GND
Test Circuit 9. Bandwidth
8
VOUT RL CL 50Ω
5pF
PACKAGE OUTLINE DIMENSIONS
MSOP-10
b
C
Dimensions
A A1 A2 b c D e E E1 L θ
Dimensions In Inches Min Max 0.031 0.047 0.000 0.008 0.030 0.038 0.012 TYP 0.006 TYP 0.114 0.122 0.020 TYP 0.114 0.122 0.185 0.201 0.016 0.026 0° 6°
Symbol In Millimeters
Min Max 0.800 1.200 0.000 0.200 0.760 0.970 0.30 TYP 0.152 TYP 2.900 3.100 0.50 TYP 2.900 3.100 4.700 5.100 0.410 0.650
0° 6°
θ
e
A2 A
D
9
PACKAGE OUTLINE DIMENSIONS
DFN-10
D
D/2
-B-
Dimensions In Millimeters Min
0.70 0.00 0.18 2.23 1.49 0.20 0.17 0.30
Symbol
A A1 A3 b D D2 E E2 e K K2 L L1 L2 N ND
NOM
0.75 0.02 0.20 REF 0.25 3.00 BSC 2.38 3.00 BSC 1.64 0.50 BSC
Max
0.80 0.05 0.30 2.48 1.74
INDEX AREA (D/2 × E/2) 4
0.15 C
TOP VIEW
NX
0.10 C 0.08 C 7 VIEW
D2
SEE DETAIL B
1
2
SEE DETAIL C
SIDE
D2/2
SEATING PLANE
-C-
0.40
0.50
0.15 0.13
10 5
INDEX AREA (D/2 × E/2)
4
7
NOTES:
NX K
N N-1
NX b
5
(ND-1)× e 6
BOTTOM VIEW
0.10 M C A B 0.05 M C
e
e
TERMINAL TIP
ODD TERMINAL SIDE
1.尺寸和公差符合ASME Y14.5M-1994。
2.所有尺寸以毫米为单位，角度以度（°）为单位。 3. N是端子总数。
4.终端＃1标识符和终端编号
约定应符合JESD 95-1 SPP-012。 终端＃1标识符的详细信息是可选的，但必须位于指示的区域内。 终端＃1标识符可以是模具，嵌入的金属或标记特征。 5.尺寸b适用于金属化端子，距离端子尖端0.15MM至0.30MM。
6. ND是指D侧的最大端子数。
7.单侧共面区适用于裸露的散热片以及端子。
5
DETAIL B K2 (2 PLACES)
EDGE OF PLASTIC BOOY
EXPOSED SLUG/ HEAT SINK
BOTTOM VIEW
DETAIL C
EXPOSED METALLIZED FEATURE L2
10
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