IC 封装介绍
BGA Ball GQFP Quad Flat Package rid Array TQFP 100L EBGA 6 80L LBGA 1 60L SBGA PBGA 217L SC-70 5L Plasti c Ball Grid Array SDIP SIP Single Inline Package SBGA 192L SO Small Out line Package TSBGA 680L CLCC CNR CommunSOP EIAJ ication and Networking R SOT220 TYPE II 14L SOJ 32L iser Specification Revision 1.2 SSOP 16L SSOP CPGA Ceramic Pin TO18 TO220 Grid Array TO247 DIP Dual I nline Package DIP-tab Dual Inline Package with Metal Heatsink TO264 TO3 TO5 TO52 TO71 TO72 TO78 TO8 TO92 TO93 TO99 FBGA TSOP Thin Small Outline FDIP FTO220 Package Flat P ack TSSOP or TSOP II Thin Shrink Outlin HSOP28 ITO220 e Package ITO3p uBGA Micro Bal l Grid Array JLCC LCC LDCC uBGA LGA Micro Bal l Grid Array LQFP PCDIP PGA Plasti ZIP c Pin Zig-Zag Inline PacGrid Array kage TEPBGA 28TEPBGA 288L PLCC 8L PQFP C-Bend Lead? PSDIP CERQUAD Ceramic Q LQFP 100L uad Flat Pack METAL Ceramic C QUAD 100L LAMINATE PQFP 1 CSP 112L 00L Chip ScalQFP Quad F lat Package Gull Wing Leads? e Package ase
IC封装大全及世界各大品牌
