Dielectric circuit substrate

Dielectric circuit substrate

申请(专利)号： JP19910331914

专利号： JP2892204B2 主分类号： H01G4/12 申请权利人： KYOSERA KK

公开国代码： JP 优先权国家： JP

摘 要：

PURPOSE: To provide a circuit board wherein a copper wiring pattern which is provided with excellent dielectric

characteristics (permittivity, Q-value and the like) in a microwave region and whose dielectric characteristics are not

deteriorated even by a thick-film printing method has been

formed. ;CONSTITUTION: A copper conductor layer is formed, by a thick-film method, on a dielectric porcelain

substrate which contains at least one kind selected from LaO_3/2, CeO₂, NdO_3/3, SmO_3/2 and

YO_3/2 in the ratio of 1 to 10mol% against CazrO₃. Consequently, since porcelain is not

reduced in a heat treatment in a reducing atmosphere during a copper thick-film printing operation, it is possible to provide a circuit board which is provided with an excellent dielectric

characteristic.;COPYRIGHT:

申请日： 1991-12-16 公开公告日： 1999-05-17

分类号： H01G4/12

发明设计人： FUJIKAWA

NOBUYOSHI;

KANEUCHI AKIHIRO 申请国代码： JP

优先权： 19911216 JP

33191491

摘 要 附 图：

(C)1993,JPO&Japio 主权项：

【請求項1】CaZrO3 に対して、LaO3/2 、CeO2 、NdO3/2 、SmO3/2 、YO3/2 から選ばれる少なくとも1種を1~10モル%の割合で含有する誘電体磁器基板上に銅導体層を形成し

权 利 要 求 说 明 书

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