PCB板厂一般能做到工艺分析

制程能力參數概況序號1234567891011121314層數銅箔厚度基板厚度阻然特性絕緣電阻測試電壓成品板面積最小線寬﹑線距孔壁銅厚最小焊環最小孔徑孔徑公差孔位公差外形公差RoutingPunchingPTHNPTH內層外層項目雙面板2L1/20Z, 1/10Z0.4~1.6MMTG135,TG140,TG150,TG1701M(min), 100M(max)15V(min), 300V(max)400mm*400mm3.5mil/3.5mil800U''5mil5mil0.2mm +_3mil +_3mil +_3mil +_0.2mm +_0.15mm4mil(min)8mil0.70% +_3mil +_2mil +_5°30U''多層板4~10L1/20Z, 1/10Z, 1/30Z, 2/20Z0.4~2.5MMTG135,TG140,TG150,TG1701M(min), 100M(max)15V(min), 300V(max)400mm*400mm3.5mil/3.5mil800U''5mil5mil0.2mm +_3mil +_3mil +_3mil +_0.2mm +_0.15mm4mil(min)8mil0.70% +_3mil +_2mil +_5°30U''綠油橋15絲印偏差16板邊與線路最小間距17翹曲度18圖形對位精度19各層通孔對准准度20V-CUT對位精度21V-CUT角度偏差22V-CUT板材厚度范圍23最大完成金厚(金手指)24檢驗標准：采用MIL-STD-105E AQL:MAJ=0.4,MIN=1.0