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FPGA可编程逻辑器件芯片EP1S25B672I7中文规格书 - 图文

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Table1–25.True & Emulated LVDS Specifications(Note1), (2)(Part 3 of 3)

Symbol

Non DPA ModeSampling Window

Notes to Table1–25:

(1)When J = 3 to 10, the SERDES block is used.(2)When J = 1 or 2, the SERDES block is bypassed.

(3)Clock Boost Factor (W) is the ratio between input data rate to the input clock rate.

(4)The minimum and maximum specification is dependent on the clock source (PLL and clock pin, for example) and the clock routing resource (global, regional, or

local) utilized. The I/O differential buffer and input register do not have a minimum toggle rate.(5)The txJitter specification is for true LVDS IO standard only.

(6)You can estimate the achievable maximum data rate for non-DPA mode by performing the link timing closure analysis. You should consider the board skew margin,

transmitter delay margin as well as the receiver sampling margin to determine the maximum data rate supported.(7)This is achieved by using the LVDS and DPA clock network.

(8)If the receiver with DPA enabled and transmitter are using shared PLLs, the minimum data rate is 150Mbps.

MaxMaxMax———300——300——300——300

MaxMinMinMinMinTypTypTypTypConditions

Table1–26.StratixIII DPA Lock Time Specifications (Note1), (2), (3) (Part 1 of 2)

Number of

Number of

Data

repetitions

Transitions

per 256

in one

data

repetition

transition

of training

(4)

pattern

Standard

Training Pattern

Condition (5)MinTypMax

SPI-4

00000000001111111111

without DPA PLL calibration

2

128

with DPA PLL calibrationwithout DPA PLL calibration

256 data transitions3×256 data transitions + 2×96 slow clock cycles

(6)256 data transitions3×256 data transitions + 2×96 slow clock cycles

(6)256 data transitions3×256 data transitions + 2×96 slow clock cycles

(6)

——————

——————

00001111

Parallel Rapid I/O

10010000

2128

with DPA PLL calibrationwithout DPA PLL calibration

464

with DPA PLL calibration

Stratix III Device Handbook, Volume 2

Unitps

C2C3, I3C4, I4C4L, I4L

Chapter 1:StratixIII Device Data Sheet: DC and Switching CharacteristicsSwitching Characteristics

Table1–29.StratixIII Maximum Clock Rate Support for External Memory Interfaces with Full-Rate Controller(Note1), (2), (3), (4)

Memory StandardsDDR2 SDRAM (5)DDR SDRAM

Notes to Table1–29:

(1)The supported operating frequencies listed here are memory interface maximums for the FPGA device family. Your design’s actual achievable

performance is based on design- and system-specific factors, as well as static timing analysis of the completed design.(2)This performance specification applies for interfaces with single rank unregistered DIMMs and single chip-select discrete components. For

more information on a list of other supported configurations and corresponding performance specifications, refer to the External Memory PHY Interface (ALTMEMPHY) Megafunction User Guide.(3)The values apply to column I/Os, Rows I/Os and Hybrid mode interface. Column I/Os refers to Top and Bottom I/Os. Row I/Os refers to Left and

Right I/Os. Hybrid mode refers to DQ/DQS groups wrapping over Column I/Os and Row I/Os of the device. (4)It may be possible to close timing at up to 33MHz higher, depending on your design and the Quartus setting used. Refer to the section on

advanced settings in External Memory PHY Interface (ALTMEMPHY) Megafunction User Guide.(5)We recommend use of ALTMEMPHY AFI mode to achieve these quoted maximum clock rate due to lower performance of Non-AFI mode.

C2VCCL = 1.1V300200

C3, I3VCCL = 1.1V267200

C4, I4VCCL = 1.1V233200

C4L, I4L

VCCL = 1.1V233200

VCCL = 0.9V167167

UnitMHzMHz

External Memory I/O Timing Specifications

Table1–30 and Table1–31 list StratixIII device timing uncertainties on the read and write data paths. Use these specifications to determine timing margins for source synchronous paths between the StratixIII FPGA and the external memory device. Refer to the figure for “SW (sampling window)” in “Glossary”

.

Stratix III Device Handbook, Volume 2

Chapter 1:StratixIII Device Data Sheet: DC and Switching Characteristics

Switching Characteristics

Table1–30.Sampling Window (SW) - Read Side (Note1) (Part 2 of 2)

C2

Memory Type

I/O Standard

Width

VCCL = 1.1VSW (ps)Setup

QDRII/II+ SRAMQDRII/II+ SRAM Emulation (2) RLDRAM IIRLDRAM II

Notes to Table1–30:.

(1)The values apply to Column I/Os, Row I/Os and Hybrid mode interface. Column I/Os refer to Top and Bottom I/Os. Hybrid mode refers to DQ/DQS groups

wrapping over Column I/Os and Row I/Os of the device.(2)Please refer to the section “Supporting ×36 QDRII+/QDRII SRAM Interfaces in the F780 and F1152-Pin Packages” on page8–20 in chapter 8 External Memory

Interface in StratixIII Devices for the implementation.

C3, I3VCCL = 1.1VSW (ps)Setup314314264264

Hold291337356356

C4, I4VCCL = 1.1VSW (ps)Setup337337287287

Hold291350356356

C4L, I4LVCCL = 1.1VSW (ps)Setup337337287287

Hold291350356356

C4L, I4LVCCL = 0.9VSW (ps)Setup337337287287

Hold291350356356

Hold286328336336

1.8 V HSTL1.8 V HSTL1.5 V HSTL1.8 V HSTL

×9, ×18, ×36×36×9, ×18×9, ×18

261261211211

Table1–31.Transmitter Channel-to-Channel Skew (TCCS) - Write Side (Note1)(Part 1 of 2)

C2

Memory Type

I/O Standard

Width

VCCL = 1.1VTCCS (ps)Lead

DDR3 SDRAM (with Deskew circuitry, 401MHz–533MHz)DDR3 SDRAM(8-tap phase offset, 375MHz-400MHz)

DDR3 SDRAM (8-tap phase offset, 360MHz-375MHz)

DDR3 SDRAM(10-tap phase offset, 333MHz-360MHz)

DDR3 SDRAM(10-tap phase offset, 300MHz-333MHz)

DDR2 SDRAM Differential DQS

DDR2 SDRAM Single-ended DQS

1.5V SSTL1.5V SSTL1.5V SSTL1.5V SSTL1.5V SSTL1.8V SSTL1.8V SSTL

×4,×8

253

Lag262

C3, I3VCCL = 1.1VTCCS (ps)Lead—

Lag—

C4, I4VCCL = 1.1VTCCS (ps)Lead—

Lag—

C4L, I4LVCCL = 1.1VTCCS (ps)Lead—

Lag—

C4L, I4LVCCL = 0.9VTCCS (ps)Lead—

Lag—

×4, ×8293284341332——————

×4, ×8293284341373——————

×4, ×8169470217496258528258528——

×4, ×8169470217496258528258528——

×4, ×8×4, ×8

229316

246168

230318

355239

250346

388260

250346

388260

350446

488360

Stratix III Device Handbook, Volume 2

Chapter 1:StratixIII Device Data Sheet: DC and Switching Characteristics

I/O Timing

Table1–44.EP3SL50 Row Pins Input Timing Parameters (Part 3 of 3)

ParameterI/O Standard

Fast ModelIndustrial-0.8300.9441.040-0.790-0.8440.9581.026-0.776-0.8440.9581.026-0.776-0.8300.9441.040-0.790-0.8300.9441.040-0.790-0.8210.9351.049-0.799-0.8210.9351.049-0.799-0.8901.0030.904-0.655-0.8901.0030.904-0.655

Commercial-0.8710.9981.036-0.774-0.8831.0101.024-0.762-0.8831.0101.024-0.762-0.8710.9981.036-0.774-0.8710.9981.036-0.774-0.8590.9861.048-0.786-0.8590.9861.048-0.786-0.9251.0510.906-0.645-0.9251.0510.906-0.645

C2

VCCL=1.1V

C3

VCCL=1.1V

C4

VCCL=1.1V

VCCL=1.1V

C4L

VCCL=0.9V

I3

VCCL=1.1V

I4

VCCL=1.1V

VCCL=1.1V

I4L

VCCL=0.9V

ClockUnitsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsns

GCLK

SSTL-15 CLASS I

tsuthtsuthtsuthtsuthtsuthtsuthtsuthtsuthtsuthtsuthtsuthtsuthtsuthtsuthtsuthtsuthtsuthtsuth

-1.213-1.321-1.434-1.378-1.646-1.331-1.444-1.390-1.6821.3991.707

1.5261.940

1.6622.164

1.5932.050

1.8582.077

1.5461.942

1.6812.166

1.6162.049

1.8932.123

GCLK PLLGCLKGCLK PLLGCLKGCLK PLLGCLKGCLK PLLGCLKGCLK PLLGCLKGCLK PLLGCLKGCLK PLLGCLK

-1.309-1.493-1.666-1.582-1.604-1.488-1.658-1.571-1.649-1.228-1.331-1.452-1.396-1.664-1.342-1.461-1.407-1.6991.4131.692

1.5361.930

1.6802.146

1.6112.032

1.8762.059

1.5571.931

1.6982.149

1.6332.032

1.9102.106

1.8-V HSTL CLASS I

-1.295-1.483-1.648-1.564-1.586-1.477-1.641-1.554-1.632-1.228-1.331-1.452-1.396-1.664-1.342-1.461-1.407-1.6991.4131.692

1.5361.930

1.6802.146

1.6112.032

1.8762.059

1.5571.931

1.6982.149

1.6332.032

1.9102.106

1.8-V HSTL CLASSII

-1.295-1.483-1.648-1.564-1.586-1.477-1.641-1.554-1.632-1.213-1.321-1.434-1.378-1.646-1.331-1.444-1.390-1.6821.3991.707

1.5261.940

1.6622.164

1.5932.050

1.8582.077

1.5461.942

1.6812.166

1.6162.049

1.8932.123

1.5-V HSTL CLASS I

-1.309-1.493-1.666-1.582-1.604-1.488-1.658-1.571-1.649-1.213-1.321-1.434-1.378-1.646-1.331-1.444-1.390-1.6821.3991.707

1.5261.940

1.6622.164

1.5932.050

1.8582.077

1.5461.942

1.6812.166

1.6162.049

1.8932.123

1.5-V HSTL CLASSII

-1.309-1.493-1.666-1.582-1.604-1.488-1.658-1.571-1.649-1.204-1.311-1.418-1.362-1.630-1.322-1.428-1.374-1.6661.3901.716

1.5161.950

1.6462.180

1.5772.066

1.8422.093

1.5371.951

1.6652.182

1.6002.065

1.8772.139

1.2-V HSTL CLASS I

-1.318-1.503-1.682-1.598-1.620-1.497-1.674-1.587-1.665-1.204-1.311-1.418-1.362-1.630-1.322-1.428-1.374-1.6661.3901.716

1.5161.950

1.6462.180

1.5772.066

1.8422.093

1.5371.951

1.6652.182

1.6002.065

1.8772.139

1.2-V HSTL CLASSII

-1.318-1.503-1.682-1.598-1.620-1.497-1.674-1.587-1.665-1.288-1.413-1.637-1.583-1.845-1.427-1.644-1.593-1.8801.4731.557

1.6201.773

1.8671.921

1.7991.805

2.0601.831

1.6441.769

1.8831.926

1.8191.772

2.0951.880

3.0-V PCI

GCLK PLLGCLK

3.0-V PCI-X

-1.160-1.324-1.421-1.336-1.355-1.313-1.416-1.292-1.402-1.288-1.413-1.637-1.583-1.845-1.427-1.644-1.593-1.8801.4731.557

1.6201.773

1.8671.921

1.7991.805

2.0601.831

1.6441.769

1.8831.926

1.8191.772

2.0951.880

GCLK PLL

-1.160-1.324-1.421-1.336-1.355-1.313-1.416-1.292-1.402

Stratix III Device Handbook, Volume 2

Chapter 1:StratixIII Device Data Sheet: DC and Switching Characteristics

I/O Timing

Table1–45.EP3SL50 Column Pins output Timing Parameters (Part 4 of 7)

ParameterI/O Standard

Current StrengthFast ModelIndustrialCommercial3.1081.6742.9861.5512.9331.4972.9121.4772.9261.4912.9291.4942.9101.4752.9051.4702.9441.5092.9251.4902.9261.4912.9091.4742.9051.470

3.3411.8693.2061.7333.1651.6923.1311.6583.1391.6663.1421.6693.1221.6493.1151.6423.1591.6863.1381.6663.1411.6683.1211.6483.1171.645

C2

VCCL=1.1V

C3

VCCL=1.1V

C4

VCCL=1.1V

VCCL=1.1V

C4L

VCCL=0.9V

I3

VCCL=1.1V

I4

VCCL=1.1V

VCCL=1.1V

I4L

VCCL=0.9V

ClockGCLK

Unitsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsnsns

tco4.7682.4664.5492.2464.4732.1704.4342.1314.4422.1384.4462.1424.4252.1204.4102.1054.4652.1614.4432.1394.4512.1474.4272.1234.4232.119

5.1715.6845.5512.5882.8412.8464.9405.4445.3112.3552.6172.6224.8635.3705.2372.2792.5632.5684.8205.3205.1872.2362.5282.5334.8285.3285.1952.2432.5202.5254.8325.3325.1992.2472.5262.5314.8105.3105.1772.2262.4992.5044.7945.2935.1602.2092.4972.5024.8515.3515.2182.2662.5502.5554.8295.3295.1962.2442.5262.5314.8385.3395.2062.2532.5462.5514.8135.3145.1812.2282.5212.5264.8095.3095.1762.2242.5162.521

5.7792.7875.5392.5635.4652.5095.4152.4745.4232.4665.4272.4725.4052.4455.3882.4435.4462.4965.4242.4725.4342.4925.4092.4675.4042.462

5.3042.7095.0652.4694.9902.3944.9412.3454.9472.3494.9502.3534.9292.3324.9122.3154.9702.3734.9482.3514.9582.3614.9322.3354.9282.331

5.8182.9495.5702.6985.4972.6255.4402.5695.4452.5735.4492.5775.4272.5555.4102.5375.4692.5965.4462.5745.4572.5855.4322.5605.4282.556

5.6885.8632.9532.7725.4405.6152.7022.5215.3675.5422.6292.4485.3105.4852.5732.3925.3155.4902.5772.3965.3195.4942.5812.4005.2975.4722.5592.3785.2805.4552.5412.3605.3395.5142.6002.4195.3165.4912.5782.3975.3275.5022.5892.4085.3025.4772.5642.3835.2985.4732.5602.379

2mA

GCLK

tco

PLLGCLK

tco

4mA

1.2 V

6mA

GCLK

tco

PLLGCLK

tco

GCLK

tco

PLLGCLK

tco

8mA

GCLK

tco

PLLGCLK

tco

8mA

GCLK

tco

PLLGCLK

tco

SSTL-2 CLASS I

10mA

GCLK

tco

PLLGCLK

tco

12mA

GCLK

tco

PLLGCLK

tco

SSTL-2 CLASSII

16mA

GCLK

tco

PLLGCLK

tco

4mA

GCLK

tco

PLLGCLK

tco

6mA

GCLK

tco

PLLGCLK

tco

SSTL-18 CLASS I

8mA

GCLK

tco

PLLGCLK

tco

10mA

GCLK

tco

PLLGCLK

tco

12mA

GCLK

tco

PLL

Stratix III Device Handbook, Volume 2

FPGA可编程逻辑器件芯片EP1S25B672I7中文规格书 - 图文

Table1–25.True&EmulatedLVDSSpecifications(Note1),(2)(Part3of3)SymbolNonDPAModeSamplingWindowNotestoTable1–25:(1)WhenJ=3to10,theSERDESblockisused.(
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