NXP Semiconductors
LPC1769/68/67/66/65/64/63
32-bit ARM Cortex-M3 microcontroller
9.Limiting values
Table 6.Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]SymbolVDD(3V3)VDD(REG)(3V3)VDDAVi(VBAT)Vi(VREFP)VIAVIParametersupply voltage (3.3 V)regulator supply voltage (3.3 V)analog 3.3 V pad supply voltageinput voltage on pin VBATinput voltage on pin VREFPanalog input voltageinput voltageon ADC related pins5 V tolerant digital I/O pins; VDD ? 2.4 VVDD = 0 V5 V tolerant open-drain pins PIO0_27 and PIO0_28IDDISSIlatchTstgTj(max)Ptot(pack)supply currentground currentI/O latch-up currentstorage temperaturemaximum junction temperaturetotal power dissipation (per package)electrostatic discharge voltagebased on package heat transfer, not device power consumptionhuman body model; all pins[7][2][5]Conditionsexternal rail[2][2][2]Min?0.5?0.5?0.5?0.5?0.5?0.5?0.5?0.5?0.5---[6]Max+4.6+4.6+4.6+4.6+4.6+5.1+5.5+3.6+5.5100100100+1501501.5UnitVVVVVVVIfor the RTC[2][2][2][3][2][4]per supply pinper ground pin?(0.5VDD(3V3)) < VI < (1.5VDD(3V3)); Tj < 125 ?CmAmAmA?C?CW VESD[1]
?65-?4000+4000VThe following applies to the limiting values:
a)This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessivestatic charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the ratedmaximum.
b)Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
c)The limiting values are stress ratings only. Operating the part at these values is not recommended, and proper operation is notguaranteed. The conditions for functional operation are specified in Table 8.Maximum/minimum voltage above the maximum operating voltage (see Table 8) and below ground that can be applied for a short time(< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter lifetime of the device.See Table 19 for maximum operating voltage.Including voltage on outputs in 3-state mode.
VDD present or not present. Compliant with the I2C-bus standard. 5.5 V can be applied to this pin when VDD is powered down.The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determinedbased on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k? series resistor.
[2][3][4][5][6][7]
LPC1769_68_67_66_65_64_63All information provided in this document is subject to legal disclaimers.? NXP Semiconductors N.V. 2020. All rights reserved.
Product data sheetRev. 9.10 — 8 September 2020 45 of 93
NXP Semiconductors
LPC1769/68/67/66/65/64/63
32-bit ARM Cortex-M3 microcontroller
10.Thermal characteristics
The average chip junction temperature, Tj (?C), can be calculated using the following equation:
Tj=Tamb+?PD?Rth?j–a??
(1)
?Tamb = ambient temperature (?C)
?Rth(j-a) = the package junction-to-ambient thermal resistance (?C/W)?PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of the I/O pins is often small and many times can be negligible. However it can be significant in some applications.
Table 7.Thermal resistance (?15 %)
ConditionsMax/MinUnitSymbolParameterLQFP100Rth(j-a)Rth(j-c)thermal resistance from junction to ambient thermal resistance from junction to case thermal resistance from junction to ambient thermal resistance from junction to case JEDEC (4.5 in ? 4 in); still air38.019.065?C/W?C/W?C/WSingle-layer (4.5 in ? 3 in); still air55.09TFBGA100Rth(j-a)Rth(j-c)JEDEC (4.5 in ? 4 in); still air55.29.5?C/W?C/W?C/WSingle-layer (4.5 in ? 3 in); still air45.6LPC1769_68_67_66_65_64_63All information provided in this document is subject to legal disclaimers.? NXP Semiconductors N.V. 2020. All rights reserved.
Product data sheetRev. 9.10 — 8 September 2020 46 of 93
MEMORY存储芯片MPC8313CVRAFFC中文规格书 - 图文
