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SEMICONDUCTOR DEVICE

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SEMICONDUCTOR DEVICE

申请(专利)号: US201916273572

专利号: US2020006342A1 主分类号: H01L27/092

申请日: 2019-02-12 公开公告日: 2020-01-02

分类号: H01L27/092;

H01L29/78; H01L29/06; H01L21/8238 发明设计人: GUYOUNG CHO;

SUBIN SHIN;

DONGHYUN ROH; BYUNG-SUK JUNG; SANGJIN HYUN 申请国代码: US

优先权: 20180629 KR 10-2018-0076069

摘 要 附 图:

申请权利人: SAMSUNG

ELECTRONICS CO., LTD.

公开国代码: US 优先权国家: KR

摘 要:

Disclosed is a semiconductor device comprising a substrate, a plurality of active patterns that protrude from the substrate, a device isolation layer between the active patterns, and a passivation layer that covers a top

surface of the device isolation layer and exposes upper portions of the active patterns. The device isolation layer

includes a plurality of first isolation parts adjacent to facing sidewalls of the active patterns, and a second isolation part between the first isolation parts. A top surface of the second isolation part is located at a lower level than that of top surfaces of the first isolation parts. 主权项:

1. A semiconductor device, comprising:

a substrate;

权 利 要 求 说 明 书

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SEMICONDUCTOR DEVICE

SEMICONDUCTORDEVICE申请(专利)号:US201916273572专利号:US2020006342A1主分类号:H01L27/092申请日:2019-02-12公开公告日:2020-01-02分类号:H01L27/092;H01L29/78;H01L29/06;H01L21/
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