SEMICONDUCTOR DEVICE
申请(专利)号: US201916273572
专利号: US2020006342A1 主分类号: H01L27/092
申请日: 2019-02-12 公开公告日: 2020-01-02
分类号: H01L27/092;
H01L29/78; H01L29/06; H01L21/8238 发明设计人: GUYOUNG CHO;
SUBIN SHIN;
DONGHYUN ROH; BYUNG-SUK JUNG; SANGJIN HYUN 申请国代码: US
优先权: 20180629 KR 10-2018-0076069
摘 要 附 图:
申请权利人: SAMSUNG
ELECTRONICS CO., LTD.
公开国代码: US 优先权国家: KR
摘 要:
Disclosed is a semiconductor device comprising a substrate, a plurality of active patterns that protrude from the substrate, a device isolation layer between the active patterns, and a passivation layer that covers a top
surface of the device isolation layer and exposes upper portions of the active patterns. The device isolation layer
includes a plurality of first isolation parts adjacent to facing sidewalls of the active patterns, and a second isolation part between the first isolation parts. A top surface of the second isolation part is located at a lower level than that of top surfaces of the first isolation parts. 主权项:
1. A semiconductor device, comprising:
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SEMICONDUCTOR DEVICE
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