METHOD OF DISPLAYING BONDING STATE OF DIE
申请(专利)号： KR20130042592
专利号： KR101422404B1 主分类号： H01L21/58 申请权利人： SEMES CO., LTD.
申请日： 2013-04-18 公开公告日： 2014-07-22
分类号： H01L21/58;
H01L21/52 发明设计人： PARK, JOON
SEOUN;
MOON, SUN HONG 申请国代码： KR
优先权： 20130418 KR
20130042592
摘 要 附 图：
公开国代码： KR 优先权国家： KR
摘 要：
A method for displaying a die bonding state comprises a step for changing
coordinate information for a position on a substrate where dies are attached to match the size of a screen; a step for displaying the position and the order in which the dies are attached on the screen by using the changed coordinate
information; and a step for displaying the position in which the attachment of the dies is completed on the screen by bonding the dies on the substrate. Therefore, a worker can easily confirm the die bonding state. 主权项：
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权 利 要 求 说 明 书
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说 明 书
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METHOD OF DISPLAYING BONDING STATE OF DIE
