SEMICONDUCTOR DEVICE
申请(专利)号： US202416444933
专利号： US2024006303A1 主分类号： H01L25/16
申请权利人： RENESAS
ELECTRONICS CORPORATION
公开国代码： US 优先权国家： JP
摘 要：
Reliability of a semiconductor device is improved. The semiconductor device PKG1 includes a wiring substrate SUB1, a
semiconductor chip CHP1 and a capacitor CDC mounted on the upper surface 2t of the wiring substrate SUB1, and a lid LD formed of a metallic plate covering the semiconductor chip CHP1 and the wiring substrate SUB1. The semiconductor chip CHP1 is bonded to the lid LD via a conductive adhesive layer, and the capacitor CDC, which is thicker than the thickness of the semiconductor chip CHP1, is disposed in the cut off portion
4d1 provided in the lid LD, and is exposed from the lid LD. 主权项：
申请日： 2024-06-18 公开公告日： 2024-01-02
分类号： H01L25/16;
H01L23/498; H01L23/367; H01L23 发明设计人： TOSHIHIKO AKIBA;
KENJI SAKATA; NOBUHIRO KINOSHITA;
YOSUKE KATSURA 申请国代码： US
优先权： 20240627 JP 2024-122161
摘 要 附 图：
1. A semiconductor device comprising:
权 利 要 求 说 明 书
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SEMICONDUCTOR DEVICE
