光纤光珊的封装效果对其性能的影响
郝建忠; 高桥志郎; 蔡朝晖; 吴俊宏; 杨秀峰; 陈智浩; 吕超
【期刊名称】《《自动化学报》》 【年(卷),期】2006(032)006
【摘要】In this paper, the effects of packaging material and structure of fiber Bragg grating sensor performance are investigated. The effects of thermal expansion coefficient of different embedding materials on the temperature sensitivities of the FBG sensors are studied both theoretically and experimentally with good agreement, which provides a means for selection of FBG packaging material to achieve desiredtemperature sensitivity. We also demonstrate a 4-point bending structured FBG lateral force sensor that measures up to 242N force with well-preserved reflection spectrum, whereas for 3-point bending structure, multiple-peaks start to occur when applied force reaches 72N. 【总页数】9页(999-1007)
【关键词】Fiber bragg grating sensor; thermal expansion coefficient; lateral force sensor
【作者】郝建忠; 高桥志郎; 蔡朝晖; 吴俊宏; 杨秀峰; 陈智浩; 吕超
【作者单位】Institute for Infocomm Research 21 Heng Mui Keng Terrace Singapore 119613 Singapore; Nanyang Technological University Nanyang Avenue Singapore 639798 Singapore 【正文语种】中文