KU波段LTCC基板微带到带状线垂直互联设计
金雁冰;刘建勇
【期刊名称】《信息通信》 【年(卷),期】2016(000)002
【摘要】随着LTCC技术的发展，基板层间信号互联问题成为的LTCC电路系统设计的关键技术，文章介绍了LTCC基板微带-带状线垂直互联过渡垂直互联过渡设计，首先给出了该互联结构的主要传输原理，结合原理，进行仿真设计。并提供了一种容性加载结构，改善其传输性能，最后对加工实物进行实测。%With the development of LTCC technology ,a problem about signal interconnection among different substrate layers is becoming the key technology in the design of LTCC circuit system. This paper describes
a
vertical
interconnection
transition
structures
for
microstripline to stripline, Firstly, the main propagation principle of this interconnection structures is proposed, based on which,a model imitations work has been developed, in order to improve the performance of microwave transmission, a capacitive loaded structures is also provided, at last, This model is fabricated and tested. 【总页数】3页(43-44,45)
【关键词】垂直互联;模型仿真;容性加载结构 【作者】金雁冰;刘建勇
【作者单位】中国电子科技集团公司第三十八研究所，安徽合肥230031;中国电子科技集团公司第三十八研究所，安徽合肥230031
KU波段LTCC基板微带到带状线垂直互联设计
