(完整版)IPC标准清单-中文英文对照版

IPC标准清单No.12345678910111213141516171819202422232425262728293031323334英文名称IPC-T-50G Terms and Definition for Interconnecting and PackagingElectronic CircuitsIPC-TM-650 Test Methods ManualIPC/EIA J-STD-001C Requirements for Soldered Electrical & ElectronicAssembliesIPC/EIA J-STD-002B Solderability Tests for Component Leads,Terminations, Lugs, Terminals and WiresIPC/EIA J-STD-003A Solderability Tests for Printed BoardsIPC/EIA J-STD-004A Requirements for Soldering FluxesIPC/EIA J-STD-005A Requirements for Soldering PastesIPC-A-610D Acceptability of Electronic AssembliesIPC-A-600F Acceptability of Printed BoardsIPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use ofMoisture/Reflow Sensitive Surface Mount DevicesIPC-7711/21AIPC-9701 Performance Test Methods and Qualification Requirementsfor Surface Mount Solder AttachmentsIPC-CC-830B Qualification and Performance of Electrical InsulatingCompound for Printed Wiring AssembliesIPC-7525 Stencil Design GuidelinesIPC-7351 General Reqirements for Surface Mount Design and LandPattern StanderdIPC/WHMA-A-620 Requirements and Acceptance for Cable and WireHarness AssembliesIPC/EIA J-STD-032 Performance Standard for Ball Grid Array BallsIPC-M-108 Cleaning Guides and Handbook ManualIPC-5701 Users Guide for Cleanliness of Unpopulated Printed BoardsIPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: WhatDoes It Tell Us?IPC-CH-65A Guidelines for Cleaning of Printed Boards & AssembliesIPC-SC-60A Post Solder Solvent Cleaning HandbookIPC-SA-61A Post Solder Semi-aqueous Cleaning HandbookIPC-AC-62A Aqueous Post Solder Cleaning HandbookIPC-TR-476A Electrochemical Migration: Electrically Induced Failuresin Printed Circuit AssembliesIPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient AirIPC-TR-583 An In-Depth Look At Ionic Cleanliness TestingIPC-9201 Surface Insulation Resistance HandbookIPC-M-109 Component Handling ManualIPC-DRM-18G Component Identification Desk Reference ManualIPC-DRM-SMT-C Surface Mount Solder Joint Evaluation DeskReference ManualIPC-DRM-40E Through-Hole Solder Joint Evaluation Desk ReferenceManualIPC-SM-785 Guidelines for Accelerated Reliability Testing of SurfaceMount AttachmentsIPC-PD-335 Electronic Packaging Handbookhing at a time and All things in their being are good for somethin3536373839404142434445464748495051525354

IPC:Association Connecting Electronics Industries(电子制造协会),从The Institute of Printed CirInstitute of the Interconnecting and Packing Electronic Circuit”(电子电路互连与封装协会)逐步发展衍

hing at a time and All things in theIPC-QL 365A Certification of Facilities That Inspect/Test PrintedBoards, Components and Materials

IPC-MI-660 Incoming Inspection of Raw Materials ManualIPC-HDBK-005 Guide to Solder Paste Assessment

IPC-HDBK-830 Guideline for Design, Selection and Application ofConformal Coatings

IPC-7530 Guidelines for Temperature Profiling for Mass Soldering(Reflow & Wave) Processes

IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean Process

IPC-S-816 SMT Process Guideline & Checklist

IPC-CM-770E Component Mounting Guidelines for Printed Boards

IPC-9850-K Surface Mount Placement Equipment Characterization-KITIPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for SurfaceMount Placement Equipment Standardization

? 4 IPC-9850 Placement Accuracy Verification Panels? 1 IPC-9850 CMM Measurement Verification Panels? 150 IPC-9850 QFP-100 Glass Components? 130 IPC-9850 QFP-208 Glass Components? 150 IPC-9850 BGA-228 Glass Components? NIST Traceable Measurement Certificate? Custom Storage Case

IPC-TR-464 Accelerated Aging for Solderability EvaluationsSMC-WP-001 Soldering Capability White Paper ReportSMC-WP-005 PCB Surface Finishes

ir being are good for somethin标准清单中文名称电子电路互连与封装的定义和术语试验方法手册电气与电子组装件锡焊要求元件引线、端子、焊片、接线柱及导线可焊性试验印制板可焊性试验助焊剂需求焊膏需求印制板组装件验收条件印制板验收条件对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用电子组装件的返工与返修表面安装锡焊件性能试验方法与鉴定要求印制板组装电气绝缘性能和质量手册网版设计导则表面安装器件和焊盘图形标准通用要求电缆和引线贴装的要求和验收BGA球形凸点的标准规范清洗导则和手册非密集型印制板清洁应用导则电路板离子洁净度测量：它告诉我们什么？电化学迁移：印制电路组件的电气诱发故障IPC第3阶段非清洗助焊剂研究深入离子洁净度测试表面绝缘电阻手册元件处理手册零件分类标识手册接插件焊接点评价手册hing at a 接插件焊接点评价手册表面安装焊接件加速可靠性试验导则电子封装手册time and All th印制板及组装件清洗导则锡焊后溶剂清洗手册锡焊后半水溶剂清洗手册锡焊后水溶液清洗手册ings in their being are good for somethin印制板, 元件和材料检验/试验企业的授证原材料接收检验手册焊膏性能评价手册

敷形涂层的设计，选择和应用手册

大规模焊接(回流焊与波峰焊)过程温度曲线指南低残留不清洗工艺的选择和实施

表面安装技术过程导则及检核表印制板元件安装导则

表面贴装设备性能检测方法的描述（附Gerber格式CD盘）

表面贴装设备性能测试用的标准工具包

子制造协会),从The Institute of Printed Circiut(印制电路板协会),Thercuit”(电子电路互连与封装协会)逐步发展衍变而来.

hing at a time and All things in the可焊性加速老化评价(附修订)可焊性工艺导论

印制电路板表面清洗电子组装的IPC标准列表

ir being are good for somethinIPC标准清单

No.1234567891011121314151617181920242223242526272829303132

英文名称

IPC-T-50G Terms and Definition for Interconnecting and PackagingElectronic Circuits

IPC-TM-650 Test Methods Manual

IPC/EIA J-STD-001C Requirements for Soldered Electrical & ElectronicAssemblies

IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1

IPC-A-610D Acceptability of Electronic Assemblies

IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison

IPC-EA-100-K Electronic Assembly Reference Set

hing atIPC/WHMA-A-620 Requirements and Acceptance for Cable and WireHarness Assemblies

IPC/EIA J-STD-012 Implementation of Flip Chip and Chip ScaleTechnologyIPC-SM-784 Guidelines for Chip-on-Board Technology ImplementationIPC/EIA J-STD-026 Semiconductor Design Standard for Flip ChipJ-STD-027 Mechanical Outline Standard for Flip Chip and Chip SizeApplicationsConfigurations

IPC/EIA J-STD-028 Performance Standard for Construction of FlipChip and Chip Scale Bumps

J-STD-013 Implementation of Ball Grid Array and Other High DensityTechnology

IPC-7095 Design and Assembly Process Implementation for BGAsIPC/EIA J-STD-032 Performance Standard for Ball Grid Array BallsIPC-MC-790 Guidelines for Multichip Module Technology UtilizationIPC-M-108 Cleaning Guides and Handbook Manual

IPC-5701 Users Guide for Cleanliness of Unpopulated Printed BoardsIPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: WhatDoes It Tell Us?

IPC-CH-65A Guidelines for Cleaning of Printed Boards & AssembliesIPC-SC-60A Post Solder Solvent Cleaning Handbook

IPC-SA-61A Post Solder Semi-aqueous Cleaning HandbookIPC-AC-62A Aqueous Post Solder Cleaning Handbook

IPC-TR-476A Electrochemical Migration: Electrically Induced Failuresin Printed Circuit Assemblies

IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient AirIPC-TR-583 An In-Depth Look At Ionic Cleanliness TestingIPC-9201 Surface Insulation Resistance Handbook

IPC-TP-104-K Cleaning & Cleanliness Test Program, Phase 3 WaterSoluble Fluxes,

IPC-M-109 Component Handling Manual

IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification forNonhermetic Solid State Surface Mount Devices

IPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use ofMoisture/Reflow Sensitive Surface Mount Devices

a time and All things in their being are good for somethin