Temperature-measuring device
申请(专利)号： US20030394206
专利号： US2003231694A1 主分类号： G01J5/00
申请权利人： OHSAWA AKIHIRO 申请日： 2003-03-24 公开公告日： 2003-12-18
分类号： G01J5/00
发明设计人： AKIHIRO OHSAWA 公开国代码： US 优先权国家： JP
摘 要：
At the time when a temperature of a semiconductor wafer or the like is
measured by light without contacting to it, its temperature is measured with high precision without suffering from an
influence of changes in temperature of a light source, an influence of a bent degree or the like of an optical fiber or an
influence of a displacement of an optical system such as a lens or the like. Light output from the light source is irradiated to the semiconductor wafer through an optical fiber for irradiated light. The light reflected from the semiconductor wafer is output as reflected light through an optical fiber for the reflected light. An optical fiber for reference light having substantially the same route as those of the optical fiber for irradiated light and the optical fiber for reflected light is disposed. The light output from the light source is output as the reference light through the optical fiber for reference light without being irradiated to or reflected from the
semiconductor wafer. And, a temperature of the semiconductor wafer is measured according to the reflected light output from the optical fiber for reflected light
申请国代码： US
优先权： 20020614 JP 2002-174667
摘 要 附 图：
and the reference light output from the optical fiber for reference light. 主权项：
1. A temperature-measuring device, comprising:
权 利 要 求 说 明 书
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Temperature-measuring device
