COOLING DEVICE FOR MULTI-CHIP MODULE
申请(专利)号： JP19970287256
专利号： JPH11121666A 主分类号： H01L23/40
申请权利人： FUJITSU LTD 公开国代码： JP 优先权国家： JP
摘 要：
PROBLEM TO BE SOLVED: To easily and quickly mount a heat sink to be freely detached as required by providing a fastener for detachably fix-connecting a heat sink and a substrate of a multi-chip module(MCM). ;SOLUTION: A heat sink 1 facing on an upper surface of a substrate of an MCM is so formed, in step, as to comprises a specified clearance corresponding to electronic parts of
different heights on the substrate. Related to a clearance between an upper surface of each electronic part P and an inside surface of the heat sink 1, a heat-conductive member S is put in between for easy transfer of heat from each electronic part P to the heat sink 1. For maintenance of the MCM, etc., the heat sink 1 is detachably fixed to an MCM
substrate B using a fastener. The fastener comprises four screws N screwed, for clamping, to the heat sink 1 with the MCM substrate B in between at, for example, four corners of a bottom surface of the MCM substrate B, by loosening and
申请日： 1997-10-20 公开公告日： 1999-04-30
分类号： H01L23/40;
H01L23/36; H05K7/20 发明设计人： HIRANO MINORU;
SUZUKI MASUMI 申请国代码： JP
优先权： 19971020 JP
28725697
摘 要 附 图：
clamping operations with the screw N, attaching/detaching of the heat sink 1 is done very easily.;COPYRIGHT: (C)1999,JPO 主权项：
【請求項1】 発熱部品を含む複数個の電子部品が基板に実装され、所定の機能を有するマルチチップモジュールを冷却するための冷却装置であって、 前記複数個の電子部品の上部に対して所定クリアランスを有して覆
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COOLING DEVICE FOR MULTI-CHIP MODULE
