Resin seal die semiconductor equipment

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申请(专利)号： JP19900217013

专利号： JP2954297B2 主分类号： H01L23/50 申请权利人： HITACHI

SEISAKUSHO KK

公开国代码： JP 优先权国家： JP

摘要：

PURPOSE:To prevent the generation of resin cracks, and mount an element as large as possible under a limited external dimension, by covering the side surface of a shared inner lead with a coating film excellent in adhesion to sealing resin. CONSTITUTION:A semiconductor device is formed by sealing the following with resin 8; a semiconductor element 1, an insulating member 2, shared inner leads 3, inner leads 4 for signal, and thin metal wires 7. A film 10 excellent in adhesion to the sealing resin 8 is formed on a facing surface 3a of the inner lead 3. As the result, the exfoliation generated on the facing surface 2a of the insulating member 2 can be prevented from

progressing on the facing surface 3a of the shared inner lead 3. Thereby the deformation amount of the resin 8 in the upper part of the shared inner lead 3,

申请日： 1990-08-20 公开公告日： 1999-09-27

分类号： H01L23/50

发明设计人： KONO RYUJI;

NISHIMURA ASAO; YONEDA NAE; KITANO MAKOTO; MURAKAMI HAJIME;

YAGUCHI AKIHIRO; ANJO ICHIRO 申请国代码： JP

优先权： 19900820 JP

21701390

摘要附图：

which deformation is caused by the

cooling after semiconductor device resin sealing and the decreasing of

temperature at the time of temperature cycle test, is reduced and the generation of cracks from this part can be prevented. 主权项：

【請求項1】一主面を有する半導体素子と、この半導体素子の前記一主面上において前記半導体素子の一辺の方向に沿う領域を持つ第一のリードと、この第一のリードの前記領域と交差する方向に配置された複数の第二のリ