两种孔金属化工艺的运用体会
魏国平
【期刊名称】《印制电路信息》 【年(卷),期】2012(000)006
【摘要】直接电镀工艺和化学沉铜工艺是印制电路板孔金属化的两大主要工艺。虽然两大主要工艺目的都是使线路板两面实现互连,但其采用的原理不一样,配方相差很大,应用的设备也相差很大。文中从两种工艺优缺点比较、工艺流程及工序作用的比较、工艺参数及控制的比较着手,在应用体会中精辟分析了两种工艺应用中各个侧重的控制点。读者可根据自身特点选用相应的工艺。%Direct electroplating and electroless copper process two main processes in PTH. Although the two major technologies are designed so that the circuit board on both sides to be connected, but the principle is not the same, formulations varies greatly, application equipment also varies greatly, In this paper, two kinds of technologies are introduced by the comparison of advantages and disadvantages of the process flow and process, comparison of the effects of process parameters and control. And this paper also provides the key control points in the application, Readers can choose the corresponding process according to its own characteristics.
【总页数】4页(22-24,46)
【关键词】直接电镀;化学沉铜;印制电路板;孔金属化;背光检查法 【作者】魏国平
两种孔金属化工艺的运用体会
