第4章 控制功能及參數
主操作表:
AD809共有八個主要模式。按[ADV]或[RTD]鍵進行選擇及在選取項目後按[ENTER]確定選擇。按鍵盤上的[MODE]鍵後, 如下的操作表會顯示在屏幕下方。
AUTO SETUP PARA SERV
DIAG WHPAR TCHPCB ALNPCB
按[ADV]或[RTD]鍵選取項目後按[ENTER]執行。
其中:
AUTO SETUP PARA SERV DIAG WHPAR TCHPCB ALNPCB
= 用於執行 “AUTO Mode” 功能 = 用於執行 “SETUP Mode” 功能 = 用於執行 “PARAMETER Mode” 功能 = 用於執行 “SERVICE Mode” 功能 = 用於執行 “DIAGNOSTIC Mode” 功能 = 用於執行 “WORKHOLDER Parameter” 功能 = 用於執行 “TEACH PCB” 功能 = 用於執行 “ALIGN PCB” 功能
4.1 AUTO Mode (自動模式)
0 1 2 3 4 5 6 7 8 9 AUTO MODEAuto BondSingle Cycle BondUnload WaferWafer PRSManual Align PCBEdit Bond PointGo To Bond Pt Epoxy OffsetMissing Die Detect Replace Picked Die Enable0EnableEnable 模式 Auto 操作表# 0 項目 Auto Bond 說明 根據已編寫的焊點程式執行自動焊點。按下列的鍵可trigger不同的功能。
4.2 SETUP Mode (設定模式) SET-UP0 1 #3 4 5 6 7 8 9 Bond ArmBond HeadWafer SetWafer TableWafer PRSWorkholderEjectorEjector ValveCollet VacuumEpoxy Drum Sole按[FNT]HM ARMHM BHDHM EJHM TBLPR SRHHM EPXHM WFROffOff0 1 2 3 4 5 6 TEACH BOND ARM SET-UPPick PositionPrepick PositionBlow PositionMissing Die PositionPrebond PositionBond PositionUnload Carrier Pos040 1 2 3 4 5 6 7 8 9 WAFER PR SET-UPAdj Video LevelLoad ReferenceAdj Srch RangeCalibrationSrch AlgorithmChip/Ink Reject SizeAngle Acceptance (+/-)Search DiePattern Die Srch CodeClear All PR ReferenceDONE*****DONEDONESTREET406500 1 2 3 TEACH B/H LEVELSHead Home LevelPick LevelBond LevelReplace Die Level150 1 2 3 4 5 6 WH SET-UPTch Unload PCB PosMeasuring RulerADV PCBHome PCBRTD PCBEpoxy OffsetHome PCB Table0 1 2 3 4 5 6 7 WAFER TABLEShow Wafer CenterTeach Wafer LimitTeach Start PositionTeach Load PositionTeach PitchEdit Polygon VertexShow Wafer LimitWafer PRS36TEACH EJECTOR LEVELS0 Ejector Type1 Ejector Home Level2 Ejector Up Level 模式 操作表# 項目 Setup 0 Bond Arm 0 說明 The bondarm set-up is to define and teach the proper position of the bondarm during bonding to ensure smooth operation and better placement accuracy. Pick Position The pick position is the position where the bondarm stops after swinging in theta motion from bond position before it goes down to pick level to pick die. The range value is -36 to -40. Prepick Position 靠近拾取位置的焊臂位置, 但不能妨礙芯片圖像識別系統的攝像機。 Blow Position 當向外吹氣時的焊臂位置。 Miss Die 用於漏晶探測時調校及定義焊臂位置。 Position Prebond 靠近焊接位置的焊臂位置。 Position Bond Pos 焊接管芯到PCB上的焊臂位置。 Unload Car 當按[ADV]或[RTD]載入載具時用於定義焊臂位置。步數Position 可調。預設值是301。 Bond Head 執行焊頭參數數據輸入功能。 Head Home 焊頭在原位高度時的位置。 Level Pick Level 拾取管芯時的焊頭位置。 PICK LEVELCOLLETDIESMYLAR PAPER 1 2 3 4 5 6 1 0 1 EJECTOR CAPEJECTOR PINNOTE : THE PICK LEVEL IS JUST HITTING THE DIE. 3 4 Bond Level Replace Die Wafer Set Wafer Table Show Wafer Centre # 3 0 按[ADV]或[RTD]定義焊頭在焊接時的高度。步數可調。預設值是525。 焊頭放管芯回芯片上的高度。放回管芯的高度通常低於拾取高度(數值會增大)。 只用於AD809M-06多個芯片。 用於執行芯片工作台設定功能。 移動芯片工作台到芯片中心。 模式 操作表# 項目 1 Teach Wafer Limit 說明 To set the wafer limit based on the outside actual dimension of wafer shape, the wafer could be circle or polygon. If wafer shape is set to ‘Circle’, 3 points on the wafer edge need be located for defining the circle as in the following diagram. P1P2P3 If wafer shape is set to ‘Polygon’, use the joystick to locate the points on the edge of the wafer then press [ADV] every time a point is identified and finally press [ENTER] for the last point. Different polygon shapes of wafers are illustrated on the following sketch. 121098765434312 2 3 4 5 6 7 Teach Start Pos’n Teach Load Pos’n Teach Pitch Edit Polygon Vertex Show Wafer Limit Wafer PRS Wafer PRS Adjust Video Level Load Reference To define the position of the bond head to start to pick a die. To define the loading position of the wafer table after bonding by using the joystick to locate the position. To calculate the distance between 2 dice by using the joystick to move each die to fit with the cursor of the monitor and then press [ENTER]. This is to edit polygon wafer programming only. It offers the user to edit the wafer limit. It shows the margin of the programmed wafer area. This provides option to the user to enable or disable the PRS on some occasion. This provides option to the user to Edit the PRS Parameter on some occasion. Using [ADV] or [RTD] to adjust the digitized picture so as to make a recognizable clear pattern on the monitor. This function is applied after the die is placed. PR reference can be loaded after the lighting is adjusted and following by selecting the search range. Finally, the calibration will be done by the PR system. 4 0 1
ASM固晶机操作手册
