TP2411/TP2412/TP2414描述:
TP2411,TP2412和TP2414是低成本,单路,双路和四路轨到轨输出,单电源放大器,具有低失调和输入电压,低电流噪声和宽信号带宽。 低失调,低噪声,非常低的输入偏置电流和高速的结合使这些放大器可用于各种应用。 滤波器,积分器,光电二极管放大器和高阻抗传感器都受益于这种功能组合。音频和其他交流应用受益于这些设备的宽带宽和低失真。
这些放大器的应用包括功率放大器(PA)控制,激光二极管控制环路,便携式和环路供电的仪器,便携式设备的音频放大以及ASIC输入和输出放大器。
TP2411/TP2412/TP2414特点:
增益带宽积:10 MHz
低噪声:8.2 nV /√Hz(f = 1kHz) 摆率:7 V /μs
失调电压:1 mV(最大)
EMIRR IN +:88 dB(在2.4GHz下) 低THD + N:0.0005% 电源范围:2.2 V至5.5 V 电源电流:1.4 mA / ch
低输入偏置电流:0.3pA(典型值) 轨到轨I / O
高输出电流:70 mA(1.0V压降) –40°C至125°C的工作范围
Features Description
TP2411,TP2412和TP2414是低成本,单,双和四轨至轨输出,单电源放大器,具有低失增益带宽积:
调和输入电压,低电流噪声和宽信号带宽。 10 MHz
低噪声:8.2
nV /√Hz(f = 1kHz) 摆率:7 V /μs
失调电压:1 mV(最大) EMIRR IN +:88 dB(在2.4GHz下)
低失调,低噪声,非常低的输入偏置电流和高速的结合使这些放大器可用于多种应用。 滤波器,积分器,光电二极管放大器和高阻抗传感器都受益于这种功能组合。 音频和交流应用受益于这些设备的宽带宽和低失真。
TP2411,TP2412和TP2414是低成本,单,双和四轨至轨输出,单电源放大器,具有低低THD + N:
失调和输入电压,低电流噪声和宽信号带宽。 0.0005%
低失调,低噪声,非常低的输入偏置电流和高速的结合使这些放大器可用于多种应用。 滤波器,积分器,光电二极管放大器和高阻抗传感器都受益于这种功能组合。
电源电流:音频和交流应用受益于这些设备的宽带宽和低失真。
电源范围:2.2 V至5.5 V 1.4 mA / ch 低输入偏置电流:0.3pA(典型值) 轨到轨I / O
Applications for these amplifiers include power 高输出电流:
70 mA(1.0Vamplifier (PA) controls, laser diode control loops,
portable and loop-powered instrumentation, audio 压降)
–40°C至amplification for portable devices, and ASIC input and 125°C的工作output amplifiers. 范围
The TP2411 is single channel version available in 8-pin SOP and 5-pin SOT23 packages. The TP2412 is dual
Applicat channel version available in 8-pin SOP, SOT, TSSOP
ions
and MSOP packages. The TP2414 is quad channel 传感器信号调
version available in 14-pin SOP and TSSOP packages.
理
消费类音频 多极点有源滤 波器
控制回路放大器
? 通讯技术 ? ?
安全 扫描仪
Pin Configuration (Top View)
Low Cost, Low Noise CMOS RRIO Op amps
Order Information
Model Name TP2411
Order Number TP2411-SR TP2411-TR TP2412-SR
TP2412
TP2412-VR TP2412-TSR TP2412-TR
TP2414
TP2414-SR TP2414-TR
Package Transport Media, Quantity 8-Pin SOP 5-Pin SOT23 8-Pin SOP 8-Pin MSOP
Tape and Reel, 4,000 Tape and Reel, 3,000 Tape and Reel, 4,000 Tape and Reel, 3,000
Marking Information TP2411 411 TP2412 TP2412 TP2412 412 TP2414 TP2414
8-Pin TSSOP Tape and Reel, 3,000 8-Pin SOT23 Tape and Reel, 3,000 14-Pin SOP Tape and Reel, 2,500 14-Pin TSSOP Tape and Reel, 3,000
Absolute M axim um Ratings
Note 1
Supply Voltage: V+ – V– Note 2............................7.0V Input Voltage............................. V– – 0.3 to V+ + 0.3 Input Current: +IN, –IN Note 3.......................... ±20mA Output Short-Circuit Duration Note 4…......... Indefinite Current at Supply Pins……………............... ±60mA
Operating Temperature Range........–40°C to 125°C Maximum Junction Temperature................... 150°C Storage Temperature Range.......... –65°C to 150°C Lead Temperature (Soldering, 10 sec) ......... 260°C
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any
Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime.
Note 2: The op amp supplies must be established simultaneously, with, or before, the application of any input signals.
Note 3: The inputs are protected by ESD protection diodes to each power supply. If the input extends more than 500mV beyond the power supply, the input current should be limited to less than 10mA.
Note 4: A heat sink may be required to keep the junction temperature below the absolute maximum. This depends on the power supply voltage and how many
amplifiers are shorted. Thermal resistance varies with the amount of PC board metal connected to the package. The specified values are for short traces
connected to the leads.
ESD, Electrostatic Discharge Protection
Symbol HBM CDM
Parameter Human Body Model ESD Charged Device Model ESD
Condition
Minimum Level 2
1
Unit kV kV
MIL-STD-883H Method 3015.8 JEDEC-EIA/JESD22-C101E
Thermal Resistance
Package Type 5-Pin SOT23 8-Pin SOP 8-Pin MSOP 8-Pin TSSOP 8-Pin SOT23 14-Pin SOP 14-Pin TSSOP
θJA 250 158 210 191 196 120 180
70 36 35
θJC
81 43 45
°C/W °C/W °C/W °C/W °C/W °C/W °C/W
Unit
Electrical Characteristics
The specifications are at TA = 27°C. VS = 5V, RL = 2kΩ, CL =100pF.Unless otherwise noted.
Note 1: Full power bandwidth is calculated from the slew rate FPBW = SR/π ? VP-P
Typical Performance Characteristics
VS = ±2.75V, VCM = 0V, RL = Open, unless otherwise specified.
Offset Voltage Production Distribution
1000 900 Number = 38300 pcs
800 700 600 500 400 300 200 100
0
Offset Voltage(uV)
Open-Loop Gain and Phase
140 330 120 100 230
80 60 130 40 30 20 -70
0 -20
-170
-40
-60
-270 0.1
10
1k
100k
10M
1000M
Frequency (Hz)
Input Bias Current vs. Temperature
1.00E-11
1.00E-13
1.00E-15
1.00E-17
1.00E-19
Unity Gain Bandwidth vs. Temperature
15 14.9 14.8 14.7 14.6 14.5 14.4 14.3 14.2 14.1
14
-40
-20
0
20
40
60
80
100
120
Temperature(℃)
Input Voltage Noise Spectral Density
1000
VCC= +5V RL= 1kΩ
100
10
1 1
10
100
1k
10k
100k
1M
Frequency(Hz)
Input Bias Current vs. Input Common Mode Voltage
5.00E-16
5.00E-17
Typical Performance Characteristics
VS = ±2.75V, VCM = 0V, RL = Open, unless otherwise specified. (Continued)
Common Mode Rejection Ratio
140
120
100 80 60
40 20 0 0
1
2
3
4
Common Mode Voltage(V)
Quiescent Current vs. Temperature
1.48
1.46
1.44 1.42
1.4 1.38 1.36 1.34 1.32 1.3
-40
-15
10
35
60
85
110
Temperature(℃)
Power-Supply Rejection Ratio
140
120
100
PSRR+
80 60
PSRR-
CMRR vs. Frequency
180
160 140
120 100 80 60
40 20 0 1
100 10k 1M 100M
Frequency(Hz)
Short Circuit Current vs. Temperature
200 180
160
140 ISINK
120
100 ISOURCE
80 60 40 20 0
-50
0
50
100 150
Temperature(℃)
Quiescent Current vs. Supply Voltage
1.8 1.6
1.4
1.2
1
0.8 0.6
40
0.4
20
0.2
0 1
100
10k
1M
0 1.5
2.5
3.5
4.5
5.5
Frequency(Hz)
Supply Voltage (V)
Typical Performance Characteristics
VS = ±2.75V, VCM = 0V, RL = Open, unless otherwise specified. (Continued)
Power-Supply Rejection Ratio vs. Temperature
140 120 100 80
60 40 20 0 -50
0
50
100
150
Temperature(℃)
EMIRR IN+ vs. Frequency
100 90
80 70 60 50 40 30 20 10 0 40
400
4000
Frequency (MHz) Negative Over-Voltage Recovery
Gain=+10 ±V= ±2.5V
CMRR vs. Temperature
120
100 80 60
40 20 0 -50 0 50 100 150
Temperature(℃)
Large-Scale Step Response
Gain=+1
RL= 10kΩ
Time (20μs/div)
Positive Over-Voltage Recovery
Gain=+10
±V=±2.5V
Time (500ns/div)
Time (500ns/div)
Typical Performance Characteristics
VS = ±2.75V, VCM = 0V, RL = Open, unless otherwise specified. (Continued)
0.1 Hz TO 10 Hz Input Voltage Noise
5s/div
Positive Output Swing vs. Load Current
140
120
-40℃
25℃
100
+125℃
80
60 40
20 0
0
1
2
3
4
5
Vout Dropout (V) Offset Voltage vs Common-Mode Voltage
500 0
Vcc=±2.5V
-500 -1000 -1500 -2000 -2500 -3000
-2.5
-1.5
-0.5
0.5
1.5
2.5
Common-mode voltage(V)
Negative Output Swing vs. Load Current
0
-20
-40
-60
-80 -100
-120
+125℃
-140 25℃
-160 -40℃
-180
-200
0
1
2
3
4
5
Vout Dropout (V)
Pin Functions
-IN: Inverting Input of the Amplifier. +IN: Non-Inverting Input of Amplifier.
OUT: Amplifier Output. The voltage range extends to within mV of each supply rail.
V+ or +Vs: Positive Power Supply. Typically the voltage is from 2.2V to 5.5V. Split supplies are possible as long as the voltage between V+ and V– is between 2.2V and 5.5V. A bypass capacitor of 0.1μF as close to the part as
possible should be used between power supply pins or between supply pins and ground.
V- or -Vs: Negative Power Supply. It is normally tied to ground. It can also be tied to a voltage other than ground as long as the voltage between V+ and V– is from 2.2V to 5.5V. If it is not connected to ground, bypass it with a capacitor of 0.1μF as close to the part as
possible.
Operation
TP2411系列运算放大器可在单电源电压(2.2 V至5.5 V)或分电源电压(±1.1 V至±2.75 V)上工作,从而使其 通用性强且易于使用。 电源引脚应具有本地旁路陶瓷电容器(通常为0.001 F至0.1 F)。 这些放大器的额定电压 范围为+2.2 V至+5.5 V,并在–40°C至+ 125°C的扩展温度范围内。 典型特性中列出了可能随工作电压或温度而 变化的参数。
Applications Information
Input ESD Diode Protection
TP2411的所有引脚上均集成了内部静电放电(ESD)保护电路。 对于输入和输出引脚,此保护主要由连接在输入和电源引脚之间的电流控制二极管组成。 这些ESD保护二极管还提供电路输入过驱动保护,只要电流被限制在绝对最大额定值表中规定的10 mA。 许多输入信号固有地被限制为小于10 mA的电流。 因此,不需要限制电阻。 图1显示了如何将串联输入电阻(RS)添加到驱动输入以限制输入电流。 添加的电阻会在放大器输入端产生热噪声,在对噪声敏感的应用中,该值应保持最小。
Current-limiting resistor
required if input voltage exceeds supply rails by >0.5V.
+2.5V
V+
500Ω
IN+
Ioverload
10mA max
TP2411
Vout
5kΩ
VIN
-2.5V
500Ω
IN-
V-
INPUT ESD DIODE CURRENT LIMITING- UNITY GAIN
PHASE REVERSAL
The TP2411 op amps are designed to be immune to phase reversal when the input pins exceed the supply voltages, therefore providing further in-system stability and predictability. Figure 2 shows the input voltage exceeding the supply voltage without any phase reversal.
Figure 2. No Phase Reversal
EMI SUSCEPTIBILITY AND INPUT FILTERING
Operational amplifiers vary in susceptibility to electromagnetic interference (EMI). If conducted EMI enters the device, the dc offset observed at the amplifier output may shift from the nominal value while EMI is present. This shift is a result of signal rectification associated with the internal semiconductor junctions. While all operational amplifier pin functions can be affected by EMI, the input pins are likely to be the most susceptible. The TP2411 operational amplifier family incorporates an internal input low-pass filter that reduces the amplifier response to EMI. Both common-mode and differential mode filtering are provided by the input filter. The filter is designed for a cutoff frequency of approximately 500 MHz (–3 dB), with a roll-off of 20 dB per decade.
100 90 80 70 60 50 40 30 20 10 0 40
400
4000
Frequency (MHz)
Figure 3. TP2411 EMIRR IN+ vs Frequency
PCB Surface Leakage
在低输入偏置电流至关重要的应用中,需要考虑印刷电路板(PCB)表面泄漏的影响。 表面泄漏是由板上的湿气,灰尘或其他污染引起的。 在低湿度条件下,附近走线之间的典型电阻为1012Ω。 5V的差异将导致5pA的电流流过,这大于TP2411 / 2412/2414 OPA在+ 27°C时的输入偏置电流(典型值为±3pA)。 建议使用多层PCB布局,并在PCB表面下布线OPA的-IN和+ IN信号。 减少表面泄漏的有效方法是在敏感引脚(或走线)周围使用保护环。 保护环的偏置电压与敏感引脚的偏置电压相同。图1显示了这种类型的布局示例,用于反向增益应用。 1. For Non-Inverting Gain and Unity-Gain Buffer:
a) Connect the non-inverting pin (VIN+) to the input with a wire that does not touch the PCB surface.
b) Connect the guard ring to the inverting input pin (VIN–). This biases the guard ring to the Common Mode input voltage.
2. For Inverting Gain and Trans-impedance Gain Amplifiers (convert current to voltage, such as photo detectors):
a
) Connect the guard ring to the non-inverting input pin (VIN+). This biases the guard ring to the same reference voltage as the op-amp (e.g., VDD/2 or ground).
b) Connect the inverting pin (VIN–) to the input with a wire that does not touch the PCB surface.
Guard Ring VIN+ VIN- +VS
Figure 4 The Layout of Guard Ring
Power Supply Layout and Bypass
The TP2411/2412/2412 OPA’s power supply pin (VDD for single-supply) should have a local bypass capacitor (i.e., 0.01μF to 0.1μF) within 2mm for good high frequency performance. It can also use a bulk capacitor (i.e., 1μF or larger) within 100mm to provide large, slow currents. This bulk capacitor can be shared with other analog parts.
Ground layout improves performance by decreasing the amount of stray capacitance and noise at the OPA’s inputs a
nd outputs. To decrease stray capacitance, minimize PC board lengths and resistor leads, and place external c
omponents as close to the op amps’ pins as possible. Proper Board Layout
为了确保在PCB级别上具有最佳性能,必须在电路板布局的设计中务必小心。为避免泄漏电流,电路 板表面应保持清洁且无湿气。涂层表面可防止水分积聚,并有助于降低电路板上的寄生电阻。保持电源走线短 并适当旁路电源,可将由于输出电流变化而引起的电源干扰降至最低,例如将ac信号驱动为重负载时。旁 路电容器应尽可能靠近器件的电源引脚连接。杂散电容是放大器输出和输入的一个问题。建议将信号走线 与电源线保持至少5mm的距离,以最大程度地减少耦合.PCB上的温度变化可能会导致焊点和其他异种金属 接触点的Seebeck电压不匹配,从而导致热电压错误。为了最大程度地减少这些热电偶效应,请对电阻器进 行定向,使热源对两端均等地加热。输入信号路径应包含匹配数量和类型的组件,并在可能的情况下匹配热 电偶结的数量和类型。例如,可以使用零值电阻器之类的虚拟组件来匹配相反输入路径中的真实电阻器。匹 配组件应紧邻放置,并以相同的方式定向。确保导线的长度相等,以使热传导达到平衡。尽可能使PCB上的 热源远离放大器输入电路。强烈建议使用接地层。接地层可降低EMI噪声,还有助于在电路板上保持恒定的 温
度
。
Package Outline Dimensions
SOT23-5
D
A2
A1
L1
e
θ
Dimensions
Symbol
In Millimeters Min
Max 0.100 1.150 0.400 3.020 1.700 2.950
Dimensions In Inches Min 0.000 0.041 0.012 0.111 0.059 0.104
Max 0.004 0.045 0.016 0.119 0.067 0.116
E1
E
A1
A2 b D E E1 e e1
0.000 1.050 0.300 2.820 1.500 2.650
0.950TYP 1.800 0.300 0°
2.000 0.460 8°
0.037TYP 0.071 0.012 0°
0.079 b 0.024 8°
e1
L1
θ
Package Outline Dimensions
SOT-23-8
Dimensions
Symbol
In Millimeters Min
A A1 A2 b c D E E1 e e1 L θ
1.050 0.000 1.050 0.300 0.100 2.820 1.500 2.600
Max 1.250 0.100 1.150 0.500 0.200 3.020 1.700 3.000
Dimensions In Inches Min 0.041 0.000 0.041 0.012 0.004 0.111 0.059 0.102
Max 0.049 0.004 0.045 0.020 0.008 0.119 0.067 0.118
0.65(BSC) 0.975(BSC) 0.300 0°
0.600 8°
0.026(BSC) 0.038(BSC) 0.012 0°
0.024 8°
Package Outline Dimensions
SOP-8
A2
θ
L1
A1
e
E
D
C
Dimensions
Symbol
In Millimeters Min
Max 0.250 1.550 0.510 0.250 5.000 4.000
Dimensions In Inches Min 0.004 0.053 0.013 0.007 0.188 0.150
Max 0.010 0.061 0.020 0.010 0.197 0.157
E1
A1
A2 b C D E E1 e L1 θ
0.100 1.350 0.330 0.190 4.780 3.800
5.800 6.300
1.270 TYP 0.400 0°
1.270 8°
0.228 0.248 b
0.050 TYP 0.016 0°
0.050 8°
Package Outline Dimensions
MSOP-8
Dimensions
Symbol
In Millimeters Min
A
0.800 0.000 0.760 0.30 TYP 0.15 TYP 2.900 0.65 TYP 2.900 4.700 0.410 0°
3.100 5.100 0.650 6° 3.100 Max 1.200 0.200 0.970
Dimensions In Inches Min 0.031 0.000 0.030 0.012 TYP 0.006 TYP 0.114 0.026 0.114 0.185 0.016 0°
0.122 0.201 0.026 6° 0.122 e Max 0.047 E 0.008 0.038
E1
A1 A2 b C D
b
e E
D
E1 L1 θ
A1
R1
R L
L1 L2
θ
Package Outline Dimensions
TSSOP-8
Symbol D E b c E1 A A2 A1 e L H θ
Dimensions In Millimeters
Min
2.900 4.300 0.190 0.090 6.250 0.800 0.050 0.65(BSC) 0.500 0.25(BSC) 1°
7° 0.700 3.100 4.500 0.300 0.200 6.550 1.200 1.000 0.150
Max
Dimensions In Inches
Min
0.114 0.169 0.007 0.004 0.246 0.031 0.002 0.026(BSC) 0.020 0.01(BSC) 1°
7°0.028 0.122 0.177 0.012 0.008 0.258 0.047 0.039 0.006
Max
Package Outline Dimensions
TSSOP-14
Dimensions
E1
In Millimeters
E
Symbol
MIN
A A1 A2 b
- 0.05 0.90 0.20 0.10 4.86 6.20 4.30
TYP - - 1.00 - - 4.96 6.40 4.40 0.65 BSC
0.45
0.60 1.00 REF 0.25 BSC
0.09 0°
- -
- 8° 0.75 MAX 1.20 0.15 1.05 0.28 0.19 5.06 6.60 4.50
e
D
c
c D E E1 e L
A1
L1 L2 R
R1
R L L1 L2
θ
θ
Package Outline Dimensions
SOP-14
D
E1 E
Dimensions
Symbol
MIN
A A1
1.35 0.10 1.25 0.36 8.53 5.80 3.80
8.63 6.00 3.90 1.27 BSC
0.45
0.60 1.04 REF 0.25 BSC
0°
8° 0.80
In Millimeters
TYP 1.60 0.15 1.45
MAX 1.75 0.25 e 1.65 0.49 8.73 6.20 4.00
b
A2 b D
E E1
A A2 A1
e L L1 L2 θ
L
L1
θ
L2
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