多层板层压流胶和变形的原因与改善
赵耀;刘德威;周刚;陈六宁
【期刊名称】《印制电路信息》 【年(卷),期】2013(000)007
【摘要】 主要通过对印制电路板层压的研究，探讨一些单层多张PP结构的PCB板，在压合后产生大量流胶及芯板局部变形后导致钻孔孔偏等问题的影响因素。包括对PCB板的结构设计、半固化片的裁切尺寸、压合前的排板方式、压板过程的升温速率及半固化片的凝胶时间等影响因素的对比试验，统计各可能因素的不良率。结果表明：半固化片的凝胶时间是影响流胶大及局部孔偏的主要因素。%In this paper, by research on the printed circuit board laminates, explore some of the single-layer structure of the PCB multiple PP laminated to produce abnormal flow of plastic and inner layer core local deformation problems which leads to the drill holes partial abnormal factor. This includes the structural design of the PCB Prepreg cutting size of a row board before lamination, the heating rate of the pressure plate process and prepreg gel time comparison test of the influence factors, statistical defect rate of possible factors. The results show that:the prepreg gel time is the main factors affecting the flow of plastic large and localized holes. 【总页数】5页(18-21,26)
【关键词】多张PP结构;流胶;压合;变形;半固化片;偏孔 【作者】赵耀;刘德威;周刚;陈六宁
多层板层压流胶和变形的原因与改善
