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化学机械抛光工艺(CMP)全解

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[6] Larsen-Basse J, Liang H. Probable role of abrasion in chemo-mechanical polishing of tungsten. Wear 1999;233-235:647–54.

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[13] H.S.Leea,H.D.Jeonga,D.A.Dornfeld,Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing(CMP) [J].processes Precision Engineering.37.(2013);483–490.

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化学机械抛光工艺(CMP)全解

[6]Larsen-BasseJ,LiangH.Probableroleofabrasioninchemo-mechanicalpolishingoftungsten.Wear1999;233-235:647–54.[7]CookLM.Chemicalprocessinglasspolishing.JournalofNon-
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