SEMICONDUCTOR DEVICE
申请(专利)号： JP19890056619
专利号： JPH02235356A 主分类号： G01R31/26
申请权利人： MITSUBISHI
ELECTRIC CORP 公开国代码： JP 优先权国家： JP
摘 要：
PURPOSE:To prevent the damage of a chip by installing a pad on a dicing line on the peripheral part of a chip, which pad is used to input a signal to the chip or to
output a signal from the chip at the time of test in the wafer state.
CONSTITUTION:On the dicing line 3 of a semiconductor device, a pad 4 is arranged and a signal is inputted and outputted by using this pad 4. At the time of test in the wafer state, a pin is brought into contact with the pad 4, so that the pad 2 in a chip 1 turning to a product is not damaged at all for testing. Further, the possibility that aluminum scrap drops on the chip 1 being made into a product can be reduced. 主权项：
申请日： 1989-03-08 公开公告日： 1990-09-18
分类号： G01R31/26;
H01L21/66; H01L21/822; H01L27/04 发明设计人： IKEDA KAZUYA;
OKIHARA YOSHIHIKO 申请国代码： JP
优先权： 19890308 JP
5661989
摘 要 附 图：
权 利 要 求 说 明 书
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说 明 书
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SEMICONDUCTOR DEVICE
