EMC材料特性对MEMS加速度计封装可靠性的影响
李博伟;杨道国;张国旗
【期刊名称】《电子元件与材料》 【年(卷),期】2011(030)009
【摘要】采用有限元法分析了EMC(环氧模塑封材料)材料特性对MEMS(微电子机械系统)加速度计封装可靠性的影响.使用有限元软件ANSYS分别模拟了加速度计的输出电压、悬臂梁的挠度以及加速度计芯片的等效应力在温度循环载荷下的变化情况.结果发现,EMC的材料模式不同,MEMS加速度计的性能有明显差异.在使用EMC温度相关弹性模式和EMC粘弹性模式时,由于在高温阶段考虑了EMC材料的应力松弛特性,芯片的最大等效应力分别为83.9 MPa和55.4 MPa,低于使用EMC恒弹性模式时的等效应力(95.5 MPa).%The effects of material properties of EMC (epoxy molding compound) on the packaging reliability of MEMS (Micro-Electro-Mechanical Systems) accelerometer were evaluated using the finite element method. The changes in the output voltage of the accelerometer, the deflection of the cantilever beam and the equivalent stress of the accelerometer chip under thermal cycle conditions were simulated using a finite element software ANSYS. The results show that the performance of the MEMS accelerometer varies markedly with changes in the material mode of EMC. When the temperature-dependent elastic mode and the viscoelastic mode of EMC are employed, due to the stress relaxation of EMC being taken into consideration at high temperature stage, the
EMC材料特性对MEMS加速度计封装可靠性的影响
