MANUFACTURE OF SEMICONDUCTOR DEVICE
申请(专利)号： JP19830100385
专利号： JPS59225533A 主分类号： H01L21/56
申请权利人： TOSHIBA KK 公开国代码： JP 优先权国家： JP
摘 要：
PURPOSE:To lessen the dispersion of the amount of resin coating by stabilizing the position of the cut of resin stringing by a method wherein the up-down
movement of a nozzle is controlled, when a semiconductor pellet and a wiring wire on a lead frame are coated with a very small amount of resin.
CONSTITUTION:The nozzle 11 is
lowered and then a fixed amount of the resin 15 is sprayed (Fig. a) out of its tip onto the semiconductor pellet 13 and the wiring wire 14 on the lead frame 12. Thereafter, the nozzle 11 is raised to a position before the position of the cut of the stringing part 15a of the resin 15 as shown in Fig. (b), when the nozzle 11 is stopped momentarily. When the resin at the stringing part 15 moves slightly
downward at the time of the stop of this nozzle 11, it is raised again as shown in Fig. (c), thus cutting the part 15a.
Thereby, as shown in Fig. (d), the resin 15 coating to the pellet 13 and the wire 14
申请日： 1983-06-06 公开公告日： 1984-12-18
分类号： H01L21/56;
B05D1/26; B05D7/00; H01L33/00 发明设计人： SATOU NOBORU 申请国代码： JP
优先权： 19830606 JP
10038583
摘 要 附 图：
is completed. 主权项：
权 利 要 求 说 明 书
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MANUFACTURE OF SEMICONDUCTOR DEVICE
