世界半导体生产机台安全设计验收标准

精品汇编资料 世界半导体生产机台安全设计验收标准

Global Semiconductor Safety Services, LLC

SEMI S2-93A Product Safety Assessment

Final Report

世界半导体生产机台安全设计验收标准

Applied Materials

Chemical Mechanical Polishing System

Model: Mirra Trak

CMP工艺应用材料

June 19, 1998 Prepared for: Applied Materials 3111 Coronado Drive Santa Clara, CA 95054

Prepared by:

Global Semiconductor Safety Services, LLC

1313 Geneva Drive Sunnyvale, CA 94089 GS3 Job No. 980029 GS3 Document No. 980029F2

Client - Confidential

保密合约

The information used to prepare this report was based on interviews with Applied Materials’ engineers. The information was also based on inspections of the Chemical Mechanical Polishing System, Model: Mirra Trak. This information was gathered over the period between February 2, 1998 and February 4, 1998, and during a re-inspection of the system on June 3, 1998. A preliminary assessment of the system was also performed on September 25, 1996 through September 26, 1996 and the results of this evaluation were also used. All observations and recommendations are based on conditions and descriptions of the Chemical Mechanical Polishing System, Model: Mirra Trak, during the time of data collection and upon information made available to Global Semiconductor Safety Services. This report's significance is subject to the adequacy and representative characteristics of the Chemical Mechanical Polishing System, Model: Mirra Trak, and to the comprehensiveness of the tests, examinations and/or surveys made.

Reference to Global Semiconductor Safety Services, including reproduction of Global Semiconductor Safety Services’ service mark, in promotional materials, is permitted only with Global Semiconductor Safety Services’ express written consent. The service performed has been conducted in accordance with the standards currently accepted in our profession, and at the high level of skill and care exercised by Global Semiconductor Safety Services’ staff.

Lastly, this report has been prepared as a Client-Confidential document, intended for the exclusive use of Applied Materials and for the purpose of documentation to SEMI S2-93A. Therefore, no outside distribution will occur unless written authorization is provided by the client.

Section No.

TABLE OF CONTENTS

目录

Page

Section MANAGEMENT SUMMARY(管理摘要) ......................................... Section SCOPE(范围) .......................................................... Section SYSTEM DESCRIPTION(系统描述) ......................................... Section ASSESSMENT & TESTING METHODOLOGIES(试验方法).......................... Section SAFETY ASSESSMENT(安全评估) ..........................................

PURPOSE(目的)

SCOPE(适用范围)

SAFETY PHILOSOPHY(安全体系) GENERAL GUIDELINES(指导方针)

SAFETY-RELATED INTERLOCKS(安全互锁) CHEMICALS(化学品) IONIZING RADIATION

NON-IONIZING RADIATION NOISE(噪音)

VENTILATION AND EXHAUST(通风与排凤) ELECTRICAL

EMERGENCY SHUTDOWN(紧急停机) HEATED CHEMICAL BATHS HUMAN FACTORS ENGINEERING ROBOTIC AUTOMATION

HAZARD WARNING(危险警告)

EARTHQUAKE PROTECTION(地震警告) DOCUMENTATION(文件) FIRE PROTECTION(消防保护)

ENVIRONMENTAL GUIDELINES(环境方针)

Section RECOMMENDATIONS ..................................................... Section - ILLUSTRATIONS ......................................................

ILLUSTRATION 1 - Mirra Trak System Layout

ATTACHMENT ONE - SURFACE LEAKAGE CURRENT TEST(泄漏测试) ....................... ATTACHMENT TWO - GROUNDING RESISTANCE TEST (接地电阻测试) ...................... ATTACHMENT THREE - VERIFICATION OF EMO(紧急按钮确认) .......................... ATTACHMENT FOUR - SOUND PRESSURE LEVEL SURVEY(声压测试) ....................... ATTACHMENT FIVE - ERGONOMIC CHECKLIST(人体功力检查表) ......................... ATTACHMENT SIX - MANUAL HANDLING LIFT ANALYSIS(手动操作分析) ................... ATTACHMENT SEVEN - 揥HAT-IF” HAZARD ANALYSIS(危险分析) ........................ ATTACHMENT EIGHT - SEMI S10-1296 RISK ASSESSMENT GUIDELINE METHODOLOGY ......... CONCLUSION ....................................................................

Section MANAGEMENT SUMMARY

A follow-up safety assessment of the Applied Materials’ Chemical Mechanical Polishing System, Model: Mirra Trak (hereafter referred to as the Mirra Trak), was performed from February 2, 1998 through February 4, 1998. A further re-inspection of the system was performed on June 3, 1998. A preliminary evaluation of the system was also performed on September 25, 1996 through September 26, 1996, and the results of this evaluation were also utilized in this report. Note that this report covers only the concerns raised by integrating three separate systems, the Applied Materials FABS and Mirra CMP, and the OnTrak Synergy Integra, which together form the Mirra Trak system. For further information concerning the individual components,

3

reference the individual SEMI S2-93A reports for these units. (GS Report No. 970668TF, dated January 30, 1998 for the FABS system; GS3 Report No. 7-0100, dated September 2, 1997 for the Mirra CMP system; and GS3 Report No. 980094F, for the OnTrak Synergy Integra.) This review was performed using the criteria established by the Semiconductor Equipment and Materials International Safety Guidelines for Semiconductor Manufacturing Equipment (SEMI S2-93A Guidelines).

GS3 has used the SEMI S10-1296 Guideline Methodology to perform a Risk Assessment of any Issues remaining after the review of the information provided by Applied Materials. Note that the severity was ranked by GS3; the Likelihood (expected rate of occurrence) was provided by Applied Materials. Items which were ranked only as a 揕ow” or 揝light” risk assessment category may be considered as acceptable without corrective action, based upon criteria in the SEMI S10-1296 Guidelines. During the safety assessment of Mirra Trak, GS3 identified several positive engineering designs, as well as several issues that will need to be addressed in order to achieve full compliance with SEMI S2-93A Guidelines. This description of both positive engineering design and non-conformance issues are comprehensively described in Section of this report. Reference Section for a summary of the outstanding items.