Prototype样品Control Plan Number控制计划编号: PQP-0209Prelaunch 试产VProduction 量产Key Contact/Phone:Date(Orig)03/11/09Date(Rev.)APage 2.of 6 .Part Number/Latest Change Level产品编号/最新更改:PIMH-1002435-300A-APart Name/Description产品名称/说明:PBAS PX750Docking BoardSupplier/PlantSupplier Code/供应商代码供应商/工厂:Flextronics(Nanjing)Process/Process Name/Flow ChartMachine Device Jig,Tools forOperationOperationSymbol/流程Mfg生产用机器,设备,夹具和工Number过程Description过程图符号具No./编号/操作编号名称/操作说明Characteristics/特性Content/内容Customer Eng.Approval/Date (If Req'd)客户工程批准日期Core Team主要团队:Supplier/Plant Approval/Date供应商/工厂批准日期:Customer Quality Approval/Date (If Req'd)客户质量批准日期Other Approval/Date (If Req'd)其它批准日期Other Approval/Date (If Req'd)其它批准日期Process/程序SpecialEvaluationProduct /Process Specification /CharMeasurementClass/特殊Tolerance产品过程规格/公差Technique/评估测级别量方法Sample/样本Size/大小Freq/频次ControlMethod/控制方法Reaction Plan/反馈计划Process Instruction/过程说明Record/记录Person InCharge/责任人11Materialreceiving材料接收BANN system ( FLEX's ERPsystem)/BANN系统Confirm incoming material messageaccording to the description in order orinvoice (part no, quantity,packaging...)NA依据订单或发票的描述确认来料信息(产品号,数量,包装等)Check the packing according to thespecification依据产品规格书检查包装NARefer to individual PO message:PO no./ part no. / quantity参照对应的订单信息:订单号,产品号,数量Visual目测100%Every Lot每批NAIf physical not tally with PO orinvoice, inform buyer & submit thematerial quantity discrepancy report如果与订单或发票不符,通知采购并提交数量差异报告2NANANo damage of package包装没损坏FQP-7.5-04 (Store MaterialHandling Procedure) 仓库物料处理程序 Store-0001 (Storework instruction) 仓库管理规定FMI-7.5-001 (StoreIf the package is damaged, must beManagement procedure) 仓库管confirmed by buyer or IQC理程序如果包装损坏,必须由IQC或采购确认FQP-8.2-05(Incoming Inspection ControlProcedure)来料检验控制程序MEI-1015(LCR 4287A operation manual)Relevant inspections instructionfor the respectiveIf found any defect out of the spec,parts/component.submit to buyer to confirm the(LCR4287A操作指导)各元器defects. If confirmed the defect,件相关的检验指导buyer should hold the MRBmeeting, Inspector paste the QC onMEI-1011(The usage and maintenance ofhold label and waiting the MRBmeeting result如果有缺陷超出规lamp box)格,提交给采购确认,确认后,采购Relevant inspections instruction召集MRB会议,检验员粘贴QC待for the respectiveparts/component.调查标签在物料上,等待MRB会(灯箱的使用保养规范)各元器议结果.件相关的检验指导FQP-8.2-05(Incoming Inspection ControlProcedure)来料检验控制程序Relevant inspections instructionfor the respectiveparts/component.(来料质量控制)各元器件相关的检验指导If the temperature and RH is overthe control line, inform facilitydepartment to adjust the air-conditioning.如果温度和湿度超出控制线,通知设备部调整空调Ensure the material in order underFIFO rules保证材料先进先出FMI-7.5-001-F001(MaterialQuantityDiscrepancyReport)来料数量差异报告WarehouseKeeper库房物料管理员BANN system ( FLEX's ERPsystem)/BANN系统1First check the supplier name whether ornot in the bann system, check MPN whetheror not combine with the bann system. CheckNApacking and cosmetic.先检查供应商是否在BANN系统内,再检查MPN是否与系统一致,检查包装和外观.Dimension尺寸Coplanarity平面度NAAssure the supplier name & theMPN combine the baan system.确保供应商名称和MPN和BAAN系统相符.Visual目测100%Every Lot每批NA2IncomingInspection来料检验(Comments: forFlextronicspurchased part,adapt for thisIQC process, ForENC consignedpart, ship to store 5X-10X magnifier; lamp Box. 5-10倍放大镜,灯箱。directory.针对Flextronics采购的物料适用此程序)Callipers; ruler; Pin Gauge; RGauge; Screw gauge; 测规,标尺,PIN规,R规,螺纹规Plug Guage 塞规Vernier Caliper 游标卡尺Marble platen 大理石平台2NANAVisual目测5 pcsEvery Lot每批NA3Component cosmetic元件外观NANAAssure inspected result in thecomponent specification确保检验结果在元件规格内Visual目测AQL=0.65Every Lot每批NALCRMultimeter Power万用表,LCR,功率测量仪4Functional: Component volume(Resistor & Capacitor & Inductor )功能的:NA元件值(电阻,电容,电感)NARead from screendisplay直接读取5pcsEvery Lot每批FQP-8.2-05-F004IncomingMaterialDiscrepanciesReport(IQC 材料不符合报告）FQP-8.2-05-F001GRN(IncomingInspectionIncomingReport(接货单/Inspector进货来料检验报告）QC Accept Label检验员& StampQC接受标签 QC On holdLabel & StampQC待调查标签QC Reject label& Stamp QC拒收标签NAPsychrometer干湿计13Material storageBANN systemBANN系统材料存储ESD shelvesESD架子N/AQty/ Part No/RH&Temperature数量名称,编号,温度NATemperature 18-30℃30% Process/Process Name/Flow ChartMachine Device Jig,Tools forOperationOperationSymbol/流程Mfg生产用机器,设备,夹具和工Number过程Description过程图符号具No./编号/操作编号名称/操作说明Characteristics/特性Content/内容component part no.料号Position位置Orientation方向Precision精密度Wrong part错料Missing part少料Inverted Part元件翻面Wrong Polarity极性错误Component fall off 元件脱落Process/程序SpecialEvaluationProduct /Process Specification /CharMeasurementClass/特殊Tolerance产品过程规格/公差Technique/评估测级别量方法Sample/样本Size/大小Freq/频次ControlMethod/控制方法Reaction Plan/反馈计划Process Instruction/过程说明Record/记录Person InCharge/责任人7Visual Inspectionbefore reflow 炉3-10X magnifier 3-10倍放大镜前外观检查11.ESD静电防护2.Don't take PCBA upfor check. 不要将PCBA拿起检查NACorrect part no. position,orientation正确的料号，方向，和位置IPC-A-610D Class IIVisual目视100%Every piece每个元件NAUse nipper adjust misalignmentcomponent.If found skew/wrongrotation and other issues report toRefer to the Work instruction 参SMT Technician. 用镊子调整轻微照操作指导书歪斜元件.当发现位歪,方向错等不良时通知SMT技术员NAProductionoperator操作员8Reflow-I回流焊-ISIFLOW SMR1000SIFLOW SMR1000回流炉1NAZone temperature 温区Reflow time 回流时间Peak temperature 峰值温度pivotal 关Ramp rate斜率键Preheat temperature 预热温度Conveyer speed运送速度(Refer to the WI) (参考WI)Visual目视1 pcsEvery weekTemperatureor changeprofile graphmodel 每周/温度曲线换型号If the parameter is out thespec.,inform to process technicianadjust reflow oven parameters tillmeet the recommended profile. 如果参数超出规格,通知制程技术员调节回流炉,使之符合温度曲线.TemperaturegraphRefer to the Work instruction 参温度曲线First article照操作指导书inspection report.首件检查报告Productionoperator操作员PQC过程检验员9AOI-I自动光学检测-IAOI machineAOI机器1Tombstone 墓碑Insufficient solder 焊锡不足Excessive Solder 焊锡过量Icicle Solder 锡尖void solder 虚焊Cold solder 冷焊Poor Wetting 润湿不良Solder bridging 锡连askew 位歪Lead lift 脚翘1.Check the temperature measurementrecord and check the hot air gun'stemperature setup. 检查温度测量记录和热风枪的温度设定.2.solder iron temperature 烙铁温度3.Solder Quality 焊接质量 Misalignment偏移Cold solder 冷焊Insurricient solder 少锡Excess solder多锡AOI programAOI检测程序NAIPC-A-610D Class II IPC-A-610D 工艺标准二级AOI inspectormachineAOI检验机器100%Every piece每片SPCIf over than 3pcs similar defect perhour, escalate to line leader orengineer如果一小时超过3个类似的缺陷，提交领班和工程师IPC-A-610D Class IIPCBA drawingWork instruction参考作业指导书U-chartProductionoperator生产作业员10Rework返工Temperature measurethermometer温度测量计Soldering Iron电烙铁Hot air gun热风枪rework station 返修设备3-10Xmagnifier 3-10倍放大镜1Temperature 温度Skill 技能NARefer to the WI rework参考 WI reworkIPC-A-610D Class IITemperaturemeasure温度测量Visual目视100%1.Everyweek 每周2.Every day每天3.Everypiece 每片NA1.If out the spec.,adjust the hot airgun's temperature setup. .Andconfirm the temperature is in thecontrol limits.如果超出规格,调整热风枪温度设定.并确认温度在管制范围内.Refer to the Work instruction 参2.If out the spec.,inform process照操作指导书technician or QE.如果超出规格,则通知制程技术员或QE.3.If encounter couldn't solveproblem,inform to rework Eng. 如果遇到不能解决的问题,则通知rework工程师Calibration labeland measurementrecord校验标签和测量记录Inspect report inprocess 过程检验报告Calibrationtechnician校验技术员Productionoperator操作员PQC过程检验员Beater 搅拌器1NASolder paste type焊料种类Thawing time解冻时间NA11Printing B/S Ops辅面丝网印刷Stencil 丝网2NAStencil No. 丝网编号pivotal 关键Correct type种类正确Thawing time more than 4 hours解冻时间大于4小时 As newmust be stirred 3 minutes bystirred divice,as old solder pasteshould be stirred 3-5 minutes bymanual.对新锡膏用机器搅拌3分钟，对于已经使用的锡膏仅手动搅拌3至5分钟Visual目测100%Every bottle每瓶NAIf incorrect solder paste is used,insufficient solder paste thawingtime, must stop line and notice PEintime. 如果锡膏用错,解冻时间不足,必须停线,并及时通知PEPEI-0008Control Instruction For SolderPaste锡膏的控制指导书 PEI-2015(Operation Instruction forthe stirring Device)锡膏搅拌机操作保养指导书PEI-0008-F001(SolderPaste ControlLabel)锡膏控制标签Materialoperator 物料员Corrective stencil no., program…纠正模板,程序Visual目测100%Every shift /changemodel每班/换型号NAIf out the spec, inform SMTtechnician to check and adjust it如果超出规格,通知SMT技术员检查并调整If found the defects contiuue 3 pcs,inform the process technician orengineer to solve.如果连续3片缺陷,通知技术员或工程师解决Refer to the Work instruction参考作业指导书FQP-8.2-06-001(PQC FirstArticle CheckList)PQC首片检查单IPQC过程质量检验员Printer machine(DEK265)丝印机3Excess solder paste焊料过多Insufficient solder paste焊料不足Solder paste bridge锡桥No sodler paste漏印1.Measure the solder paste height测量锡膏高度2. Be sure to follow site procedure forwashing panels with wet solder paste. Afterwashing a panel, re-inspect the panel forany remaining solder paste residue using amicroscope. If necessary, re-wash panel andre-inspect until all solder paste/residue iscompletely removed.如果需要洗板，确保按照要求的方法操作，并且洗完之后，要用显微镜检查是否有锡残留，特别是测试孔，若发现有任何的残留必须要重新清洗直到没有残留为止；Program程序Squeegee pressure 刮刀压力Squeegee speed 刮刀速度NAIPC-A-610D class IIPrinting parameter refer to WorkInstruction丝印参数参照WIVisual目测100%Every Piece每片NARefer to the Work instruction参考作业指导书NAProductionoperator生产操作员12Solder PasterInspection-II锡膏检查-IIKY-8030L Koh Young SPIMachine1NApivotal 关键4 ~ 7 mil (stencil=5 mil)5 ~ 8 mil (stencil=6 mil)KY-8030L KohRefer to Xbar-R chart(ReviewYoung SPIthe control line quarterly)参考MachineXbar-R图（每季度更新控制线）100%Every Lot每批SPC ChartIf against the SPC control, informQE and team member to investigteQA-8.2-015 (Statistical processQA-8.2-015-and record the root cause in SPCcontrol) 统计过程控制F002chart如果不符合SPC控制,通知Refer to the Work instructionX bar - R chartQE和其他成员调查并在SPC图中参考作业指导书记录改善方法IPQC过程质量检验员Page 3 of 5Process/Process Name/Flow ChartMachine Device Jig,Tools forOperationOperationSymbol/流程Mfg生产用机器,设备,夹具和工Number过程Description过程图符号具No./编号/操作编号名称/操作说明Characteristics/特性Content/内容Process/程序Loading corrective Part& orientation,corrective station &feeder. 装正确的料和方向,正确的站和正确的喂料器Confirm the loadingmaterial with loadinglist. 根据装料清单确认所装的料SpecialEvaluationProduct /Process Specification /CharMeasurementClass/特殊Tolerance产品过程规格/公差Technique/评估测级别量方法According theCorrective Part & orientation,loading list controlcorrective station & feeder. 正确document)的料和方向,正确的站和正确依据装料清单控的喂料器制文件According theCorrective Part & orientation,loading list controlcorrective station & feeder. 正确document)的料和方向,正确的站和正确依据装料清单控的喂料器制文件Corrective SMT program 正确的SMT程序Sample/样本Size/大小Freq/频次Every shift /changemodel每班/换型号ControlMethod/控制方法Reaction Plan/反馈计划Process Instruction/过程说明Record/记录Person InCharge/责任人1NANA100%NAIf found wrong material, highlightto production leader .如果材料错误,报告给领班Refer to the Work instruction 参照操作指导书NAProductionoperator生产操作员13SMT-II贴片-IIHitachi GXH-ISFeederHitachi GXH-IS贴片机喂料器2NANA100%Every shift /changemodel每班/换型号Every shift /changemodel每班/换型号NAFQP-8.2-06If found wrong material, highlight(In-Process Inspection Controlto production leader and QE. 如果Procedure)材料错误,报告给领班和QE制程检验控制程序If out the spec, inform SMTtechnician and QE to check andadjust it. 如果超出规格,通知SMT技术员QE检查并调整FQP-8.2-06(In-Process Inspection ControlProcedure)制程检验控制程序FQP-8.2-06-001(PQC FirstArticle CheckList)PQC首片检查单FQP-8.2-06-001(PQC FirstArticle CheckList)PQC首片检查单IPQC过程质量检验员3NASMT programSMT程序NAVisual目测100%NAIPQC过程质量检验员14Visual Inspectionbefore reflow 外3-10X magnifier 3-10倍放大镜观检查1component part no.料号Position位置Orientation方向Precision精密度Wrong part错料Missing part少料Inverted Part元件翻面Wrong Polarity极性错误Component fall off 元件脱落1.ESD静电防护2.Don't take PCBA upfor check. 不要将PCBA拿起检查NACorrect part no. position,orientation正确的料号，方向，和位置IPC-A-610D Class IIVisual目视100%Every piece每个元件NAUse nipper adjust misalignmentcomponent.If found skew/wrongrotation and other issues report toRefer to the Work instruction 参SMT Technician. 用镊子调整轻微照操作指导书歪斜元件.当发现位歪,方向错等不良时通知SMT技术员NAProductionoperator操作员15Reflow-II回流焊-IISIFLOW SMR1000SIFLOW SMR1000回流炉1NAZone temperature 温区Reflow time 回流时间Peak temperature 峰值温度pivotal 关Ramp rate斜率键Preheat temperature 预热温度Conveyer speed运送速度(Refer to the WI) (参考WI)Visual目视1 pcsEvery weekTemperatureor changeprofile graphmodel 每周/温度曲线换型号If the parameter is out thespec.,inform to process technicianadjust reflow oven parameters tillmeet the recommended profile. 如果参数超出规格,通知制程技术员调节回流炉,使之符合温度曲线.TemperaturegraphRefer to the Work instruction 参温度曲线First article照操作指导书inspection report.首件检查报告Productionoperator操作员PQC过程检验员16AOI-II自动光学检测-IIAOI machineAOI机器1Tombstone 墓碑Insufficient solder 焊锡不足Excessive Solder 焊锡过量Icicle Solder 锡尖void solder 虚焊Cold solder 冷焊Poor Wetting 润湿不良Solder bridging 锡连askew 位歪Lead lift 脚翘AOI programAOI检测程序NAIPC-A-610D Class II IPC-A-610D 工艺标准二级AOI inspectormachineAOI检验机器100%Every piece每片SPCIf over than 3pcs similar defect perhour, escalate to line leader orengineer如果一小时超过3个类似的缺陷，提交领班和工程师IPC-A-610D Class IIPCBA drawingWork instruction参考作业指导书U-chartProductionoperator生产作业员17ICTICT HP 3070Software loading1refer to the \ICT Test programchecking If the revison of the testprogram is correct or notpivotal 关according to WI键按照WI核对当前的测试版本是否正确ICT TESTVisual100%Every piece每片SPCIf find defect, escalate to line leaderor engineerRefer to the Work instruction 参如果发现缺陷，提交领班和工程照操作指导书师If found any problem inform theTechnician. 如果发现 问题,通知技术员.U-chartProductionoperator生产作业员18Depanelization分板Nip 斜口钳File 锉刀Cutter machine 分板机119Final Inspection16X Microscope 16倍终检显微镜1No Crack无裂痕No burs无毛刺Exposed Copper 露铜Damaged Component 元件损坏1. Solder ball/锡球? Solder balls that are entrapped orencapsulated and do not violate minimumelectrical clearance and < 0.13mm.锡球被裹夹/包封不违反最小电气间隙，或者小于0.13mm;? No solder balls > 0.13mm are acceptable.小于0.13mm的锡球是可以接受的2.Solder bridge 锡连，同一线路的锡连可以接受；3.Carefully inspect for damaged or missingcomponents仔细确认是否有料坏或者缺件；4.Verify all labels are present and withcorrect information.确认所有的标签是否正确，是否都贴在正确的位置；NANAIPC-A-610D Class IIVisual目视100%Every Piece每片NARefer to the Work instruction 参照操作指导书NAProductionoperator操作员NANAIPC-A-610D Class IIVisual目视100%Every piece每片If found any problem, inform to thetechnician, repeated failure toSPC chartRefer to the Work instruction 参escalate to eng. 如果发现问题,通SPC控制图照操作指导书知技术员检查印刷机.如重复发生则上报工程师.U-ChartU 图Productionoperator操作员Page 4 of 5 Process/Process Name/Flow ChartMachine Device Jig,Tools forOperationOperationSymbol/流程Mfg生产用机器,设备,夹具和工Number过程Description过程图符号具No./编号/操作编号名称/操作说明Characteristics/特性Content/内容Process/程序SpecialEvaluationProduct /Process Specification /CharMeasurementClass/特殊Tolerance产品过程规格/公差Technique/评估测级别量方法Sample/样本Size/大小Freq/频次ControlMethod/控制方法Reaction Plan/反馈计划Process Instruction/过程说明Record/记录Person InCharge/责任人20Debug维修Temperature measurethermometer温度测量计Soldering Iron电烙铁Hot air gun热风枪BGA rework station BGA返修设备3X magnifier 3倍放大镜11.Check the temperature measurementrecord and check the hot air gun'stemperature setup. 检查温度测量记录和热风枪的温度设定.2.solder iron temperature 烙铁温度3.Solder Quality焊接质量 Misalignment偏移Cold solder冷焊Insurricient solder 少锡Excess solder多锡Temperature温度NARefer to the WI rework参考 WI reworkIPC-A-610D Class IITemperaturemeasure温度测量Visual目视100%1.Everyweek 每周2.Every day每天3.Everypiece 每片NA1.If out the spec.,adjust the hot airgun's temperature setup. .Andconfirm the temperature is in thecontrol limits.如果超出规格,调整热风枪温度设定.并确认温度在管制范围内.Refer to the Work instruction 参2.If out the spec.,inform process照操作指导书technician or QE.如果超出规格,则通知制程技术员或QE.3.If encounter couldn't solveproblem,inform to rework Eng. 如果遇到不能解决的问题,则通知rework工程师CalibrationCalibration labeltechnician 校and measurement验技术员record校验标签Product合测量记录operator 操作Inspect report in员process 过程检PQC 过程检验报告验员21QA inspectionQA 检验16X Microscope 16倍显微镜11. Solder ball/锡球? Solder balls that are entrapped orencapsulated and do not violate minimumelectrical clearance and < 0.13mm.锡球被裹夹/包封不违反最小电气间隙，或者小于0.13mm;? No solder balls > 0.13mm are acceptable.小于0.13mm的锡球是可以接受的2.Solder bridge 锡连，同一线路的锡连可以接受；3.Carefully inspect for damaged or missingcomponents仔细确认是否有料坏或者缺件；4.Verify all labels are present and withcorrect information.确认所有的标签是否正确，是否都贴在正确的位置；QA Verification NANAIPC-A-610D-II16X magnifier16倍的放大镜100%Every Piece每片NAadjust the material,inform to thetechnician and eng. to check theRefer to the Work instruction 参machine when repeated failure.调照操作指导书整物料，当重复不良时，通知技术，工程师检查机器。U-ChartU 图Productionoperator 操作员PQC 过程检验员StarStorageProcess Inspectio nFinish Page 5 of 5
PQP-0209 Quality Control Plan For PIMH-1002435-300A-A 质量控制计划
