CIRCUIT MODULE AND ELECTRONIC DEVICE

CIRCUIT MODULE AND ELECTRONIC DEVICE

申请(专利)号： EP20090841806

专利号： EP2410561A1 主分类号： H01L23/28

申请日： 2009-11-26 公开公告日： 2012-01-25

分类号： H01L23/28;

H01L21/56; H01L25/04; H01L25/18

发明设计人： INOUE, KATSUHIRO 申请国代码： EP

优先权： 20090319 JP

2009068022

摘 要 附 图：

申请权利人： PANASONIC

CORPORATION 公开国代码： EP 优先权国家： JP

摘 要：

A circuit module capable of individually shielding electronic components and also responding to thinned requirement is provided.;A circuit module 10 includes a circuit board 11, two electronic

components 16A, 16B mounted on the circuit board 11, a molding resin layer 12 for sealing the circuit board 11 and the electronic components 16A, 16B, and a conductive resin layer 13 formed of a conductive resin on the molding resin layer 12. A slit S which penetrates the molding resin layer 12 and reaches the circuit board 11 is formed between the two electronic components 16A, 16B, and the conductive resin is filled inside the slit S. 主权项：

A circuit module comprising:

a circuit board having a first surface and a second surface

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说 明 书

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