Electronic module
申请(专利)号： EP19950106186
专利号： EP0689374B1 主分类号： H05K5/00 申请权利人： WABCO GMBH &
CO. OHG
申请日： 1995-04-26 公开公告日： 2003-03-05
分类号： H05K5/00;
B60R16/02 发明设计人： LEHRMANN,
JOACHIM; GUDAT,
WOLFGANG 申请国代码： EP
优先权： 19940624 DE
4422113
摘 要 附 图：
公开国代码： EP 优先权国家： DE
摘 要：
The electronic module has an open
housing ?1ü with built in guides ?2ü that provide locations for the circuit board ?4ü. The housing is produced from metal. The top end of the circuit board has a cover ?5ü of metal that acts as a heat sink and has an aperture to receive a connecting plug ?8ü and fixing screws ?14ü. Heat generating power elements ?3ü connect directly onto the circuit board and are in contact with the cover elements ?11ü The cover shape is such that during immersion in a solder bath the contact point are not covered. When
completed the module is inserted into the housing. <IMAGE> 主权项：
Electronic module having a pot-shaped housing part (1) for accommodating at least one circuit board
权 利 要 求 说 明 书
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说 明 书
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Electronic module
