Air-gap insulated interconnections

Air-gap insulated interconnections

申请(专利)号： US20040711394

专利号： US7285474B2 主分类号： H01L21/76 申请权利人： BRENT A.

ANDERSON;

ANDRES BRYANT; JEFFREY P. GAMBINO; ANTHONY K. STAMPER 公开国代码： US 优先权国家： US

申请日： 2004-09-16 公开公告日： 2007-10-23

分类号： H01L21/76;

H01L21/4763 发明设计人： BRENT A.

ANDERSON; ANTHONY K. STAMPER;

ANDRES BRYANT; JEFFREY P. GAMBINO 申请国代码： US

优先权： 20040916 US

71139404

摘 要 附 图：

摘 要：

Air-gap insulated interconnection

structures and methods of fabricating the structures, the methods including: forming a dielectric layer on a substrate; forming a capping layer on a top surface of the dielectric layer; forming a trench through the capping layer, the trench extending toward said substrate and into but not through, the dielectric layer; forming a sacrificial layer on opposing sidewalls of the trench; filling the trench with a electrical conductor; and removing a portion of the sacrificial layer from

between the electrical conductor and the dielectric layer to form air-gaps. 主权项：

1. A method, comprising:

(a) forming a dielectric layer on a substrate;

权 利 要 求 说 明 书

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说 明 书

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