Power device implemental circuit substrate

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申请(专利)号： JP19920029078U

专利号： JPH0581956U 主分类号： H01R9/09

申请权利人：古河電気工業株式

会社

公开国代码： JP 优先权国家： JP

摘要：

(57)< Abstract > < Constitution > The fixed metallic parts 27 soldered in circuit substrate 11 pawaFastening with screw terminal 15 of debaisu 13 and 21, pawadeVise 13 is locked in circuit substrate 11. bu of power deviceThe blade edge soldered in redo terminal 17 and circuit substrate 11The child, the U die splicing fitting which possesses the lamp receptacle terminal on both sidesThrough 39, you joint. < Advantages > The power device making use of the screw terminal the circuit basisIt can lock in the board. The screw terminal does not fasten the circuit substrateSo breaking the through hole of circuit substrate and creeping of

insulating boardIt does not occur. As for blade terminal of power device U die joint goldYou can joint to the circuit substrate simply with tool. Because of this

powerAutomation and standardization of

申请日： 1992-04-06 公开公告日： 1993-11-05

分类号： H01R9/09;

H01L23/40; H05K1/18 发明设计人：小林健造;

山本雅章; 山森一之; 谷田部博申请国代码： JP

优先权： 19920406 JP

2907892

摘要附图：

device implemental job are possible. 主权项：

【請求項1】ネジ端子およびブレード端子を有するパワーデバイスと、そのパワーデバイスを実装する回路基板とを備え、

回路基板の、パワーデバイスのネジ端子に対応する位置に、回路基板を貫通する固定金具を半田付

权利要求说明书