BES2300-Z Product Specification Package Thickness < 1.6 mm 1.6mm to 2.5 mm ≥2.5 mm Volume mm3< 350 260 + 0°C* 260 + 0°C* 250 + 0°C* Volume mm3 350 -2000 260 + 0°C* 250 + 0°C* 245 + 0°C* Volume mm3> 2000 260 + 0°C* 245 + 0°C* 245 + 0°C* (a) Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature(this means Peak
reflow temperature +0℃.For example 260℃+ 0℃) at the rated MSL level.
Table 7-3 Solder Reflow Profile Feature
Profile Feature Average Ramp-Up Rate (tsmax to tp) Temperature Min (Tsmin) Pre_heat Time Maintained above Peak/Classification Temperature (Tp) Time within 5°C of Actual Peak Temperature (tp) Ramp-Down Rate 6 Time 25°C to Peak Temperature 8 Temperature Min (Tsmin) Time (ts) Temperature (TL) Time (tL) Specification 3°C/second max. 150°C 150°C 60-180 seconds 217°C 60-150 seconds 260°C 20-40 seconds 6°C/second max. 8 minutes max. 7.3 RoHS Compliant
The products meet the requirements of Directive 2011/65/EU of Europe Parliament and of the Council on the Restriction of Hazardous Substance (RoHS). The products are free from halogenated or antimony trioxide-based flame retardants and other hazardous chemicals.
7.4 ESD Sensitivity
Electrostatic discharge (ESD) occurs naturally in laboratory and factory environments. An established high-voltage potential is always at risk of discharging to a lower potential. If this discharge path is through a semiconductor device, destructive damage may result. ESD countermeasures and handling methods must be developed and used to control the factory environment at each manufacturing site. BES products must be handled according to the ESD Association standard: ANSI/ESD S20.20-1999, Protection of Electrical and Electronic Parts, Assemblies, and Equipment. BES2300-Z ESD ratings will be available in Product Reliability Report of BES2300-Z.
7.5 Storage Alert
i.
Calculated shelf life in vacuum sealed bag 24 months at<40°Cand 90% relative humidity (RH).
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BES2300-Z Product Specification
ii. The out-of-bag duration is the time a device can be on the factory floor before being installed onto a PCB. It is defined by the device MSL rating. Refer to 9.4 moisture sensitivity level.
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BES2300-Z Product Specification
8 Ordering Information
Part Number BES2300-Z Type BGA-80B Package Size 6.2 X 4.5X 1.30mm 0.4mm/0.5mm Pitch (a) MoQ: Minimum order quantity
Packing Tape & Reel MoQ(ea) 3K
BES2300-Z Product Specification
9 Tape and Reel Information
9.1 Tape Orientation
General orientation of BES2300-Z BGA-80B package in the carrier tape.
Figure 9-1 Tape Orientation
9.2 Reel Dimensions
The dimension of the reel for BES2300-Z.
Figure 9-2 Reel Dimensions (All dimensions in millimeters)
(a) All dimensions in millimeters
(b) Reel color: Black, Each Plate products in 3000.
BES2300-Z Product Speci?cation
9.3 Tape Dimensions
The dimensions of the tape for BES2300-Z BGA-80B.
Figure 9-3 Tape Dimensions (All dimensions in millimeters)
9.4 Moisture Sensitivity Level
BES2300-Z is quali?ed to moisture sensitivity level MSL3 in accordance with JEDEC J-STD-020.
BES2300
